Method of making through-hole vias in a substrate

• US 7,814,652 B2
• Filed: 07/25/2008
• Issued: 10/19/2010
• Est. Priority Date: 09/20/2000
• Status: Expired due to Fees

• Current Assignee: ProterixBio, Inc.
• Original Assignee: BioScale, Inc.
• Inventors: Bellew, Colby, Liu, Kelvin, Collins, Boyce E.
• Primary Examiner(s): Banks; Derris H
• Assistant Examiner(s): NGUYEN, TAI V
• Application Number:
  US12/180,169
• Publication Number:
  US 20090074951A1
• Time in Patent Office: 816 Days
• Field of Search: 298/54, 298/30, 298/31, 298/32, 297/12, 297/09, 422/68.1, 422/107, 422/108, 435/4, 435/7.1, 435/287.2, 427/97.7, 427/97.2
• US Class Current: 29/854
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: G01N 2291/014 Resonance or resonant frequency
• CPC Class Codes: G01N 2291/0255 (Bio)chemical reactions, e.g. on biosensors
• CPC Class Codes: G01N 2291/0256 Adsorption, desorption, surface mass change, e.g. on biosensors
• CPC Class Codes: G01N 2291/02818 Density, viscosity
• CPC Class Codes: G01N 2291/0423 Surface waves, e.g. Rayleigh waves, Love waves
• CPC Class Codes: G01N 2291/0427 Flexural waves, plate waves, e.g. Lamb waves, tuning fork, cantilever
• CPC Class Codes: G01N 2291/106 one or more transducer arrays
• CPC Class Codes: G01N 29/02 Analysing fluids using acoustic emission techniques G01N29/14 ; constructional or flow details for analysing fluids G01N29/222; optoacoustic fluid cells G01N29/2425
• CPC Class Codes: G01N 29/022 Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices microdevices per se B81B
• CPC Class Codes: G01N 29/222 Constructional or flow details for analysing fluids optoacoustic fluid cells G01N29/2425
• CPC Class Codes: G01N 29/223 Supports, positioning or alignment in fixed situation mounting transducers per se G10K11/004
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/53052 including position sensor

Abstract

A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.

Claims

1. A method of forming a sensor assembly, comprising:

1) forming a housing assembly;

2) accommodating a sensor module in the housing assembly further comprising;

a) fabricating a membrane layer of a sensor on a top surface of a substrate, the substrate comprising a plurality of sensing regions, the membrane layer having an electrode within or below the top surface;

b) forming a plurality of cavities corresponding to each said sensing region;

c) forming a second electrode of the sensor at a bottom of each said cavity; and

d) providing a plurality of conductive vias from each said cavity to a bottom surface of the substrate, the bottom surface being opposite the top surface; and

3) forming a fluidics module over the sensor module, comprising;

a) attaching a nonconductive frame to the substrate to form a fluid sample reservoir over the top surface of the substrate.

2. The method of claim 1 wherein forming a fluidics module over the sensor module further comprises:

b) forming a fluidics base;

c) forming a window assembly by engaging a frame with the fluidics base; and

d) positioning a window directly above the fluid sample reservoir.

3. The method of claim 1 further comprising evacuating and sealing each said cavity.

4. The method of claim 1 further comprising providing a fluid sample to the fluid sample reservoir over the membrane layer.

5. The method of claim 1 further comprising:

a) mounting an electronic component in the housing assembly; and

b) providing an electrical connection between the sensor module and the electronic component.

6. The method of claim 5 further comprising providing the electrical connection by electrically engaging contacts of the electrical component with the conductive vias.

7. The method of claim 1 further comprising directing a fluid to the reservoir.