MEMS processing
First Claim
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1. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:
- providing a transparent substrate having an array of MEMS devices formed thereon;
identifying at least one MEMS device in the array of MEMS devices exhibiting a desiccant pattern, wherein the desiccant pattern is identified by a time delay between the at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state, and if the time delay is between about 1 μ
s to about 20 μ
s, baking the at least one MEMS device under predetermined conditions to remove contaminants from the at least one MEMS device, wherein the predetermined conditions comprise a baking time and a baking temperature, and wherein said baking time is between about 10 minutes and about 3 hours; and
sealing said transparent substrate to a backplate to form a package, wherein the backplate comprises a desiccant.
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Abstract
Methods for forming a MEMS display device are provided. In one embodiment, a transparent substrate comprising an array of MEMS devices (e.g., interferometric modulators) formed thereon is annealed following removal of a sacrificial silicon layer. The array is subsequently encapsulated with a backplate comprising a desiccant. MEMS devices disposed below the desiccant have an offset voltage substantially equal to zero.
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Citations
22 Claims
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1. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:
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providing a transparent substrate having an array of MEMS devices formed thereon; identifying at least one MEMS device in the array of MEMS devices exhibiting a desiccant pattern, wherein the desiccant pattern is identified by a time delay between the at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state, and if the time delay is between about 1 μ
s to about 20 μ
s, baking the at least one MEMS device under predetermined conditions to remove contaminants from the at least one MEMS device, wherein the predetermined conditions comprise a baking time and a baking temperature, and wherein said baking time is between about 10 minutes and about 3 hours; andsealing said transparent substrate to a backplate to form a package, wherein the backplate comprises a desiccant. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:
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providing a transparent substrate with an array of MEMS devices formed thereon; sealing said transparent substrate to a backplate to form a package; providing a desiccant within the package; identifying at least one MEMS device in the array of MEMS devices exhibiting a desiccant pattern, wherein the desiccant pattern is identified by a time delay between the at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state; and if the time delay is between about 1 μ
s to about 20 μ
s, removing voltage-changing contaminants from the at least one MEMS device in the array, wherein removing voltage-changing contaminants comprises baking for between about 10 minutes and about 3 hours. - View Dependent Claims (13, 14, 15, 16, 17)
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18. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:
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providing a transparent substrate with an array of MEMS devices formed thereon; sealing said transparent substrate to a backplate to form a package, wherein the backplate comprises one or more holes, and wherein a desiccant is located within the package; identifying a time delay between at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state; and after forming the package, if the time delay is between about 1 μ
s to about 20 μ
s, heating the package at less than about 200°
C. for a predetermined length of time sufficient to allow contaminants in the package to escape through the one or more holes, wherein the predetermined length of time is between about 10 minutes and about 3 hours. - View Dependent Claims (19, 20, 21, 22)
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Specification