MEMS processing

• US 7,816,164 B2
• Filed: 12/01/2006
• Issued: 10/19/2010
• Est. Priority Date: 12/01/2006
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Natarajan, Bangalore, Su, Fritz Y. F., Kothari, Manish, Khonsari, Nassim
• Primary Examiner(s): Nguyen; Ha Tran T
• Assistant Examiner(s): Campbell; Shaun
• Application Number:
  US11/566,172
• Publication Number:
  US 20080130082A1
• Time in Patent Office: 1,418 Days
• Field of Search: 438/48, 359/238
• US Class Current: 438/48
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

Methods for forming a MEMS display device are provided. In one embodiment, a transparent substrate comprising an array of MEMS devices (e.g., interferometric modulators) formed thereon is annealed following removal of a sacrificial silicon layer. The array is subsequently encapsulated with a backplate comprising a desiccant. MEMS devices disposed below the desiccant have an offset voltage substantially equal to zero.

Claims

1. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:

providing a transparent substrate having an array of MEMS devices formed thereon;

identifying at least one MEMS device in the array of MEMS devices exhibiting a desiccant pattern, wherein the desiccant pattern is identified by a time delay between the at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state, and if the time delay is between about 1 μ

s to about 20 μ

s, baking the at least one MEMS device under predetermined conditions to remove contaminants from the at least one MEMS device, wherein the predetermined conditions comprise a baking time and a baking temperature, and wherein said baking time is between about 10 minutes and about 3 hours; and

sealing said transparent substrate to a backplate to form a package, wherein the backplate comprises a desiccant.

2. The method of claim 1, wherein said contaminants are configured to activate the at least one MEMS device within said array at a voltage different than other of the MEMS devices within said array.

3. The method of claim 1, wherein said baking time is between about 1 hour and about three hours.

4. The method of claim 1, wherein the baking temperature is less than or equal to about 200°

C.

5. The method of claim 4, wherein the baking temperature is less than or equal to about 150°

C.

6. The method of claim 5, wherein the baking temperature is less than or equal to about 120°

C.

7. The method of claim 1, wherein the desiccant is configured to react with said contaminants so as to alter an activation voltage of the at least one MEMS device in said array.

8. The method of claim 1, wherein the desiccant is configured to react with the contaminants so as to alter a release voltage of the at least one MEMS device in the array.

9. The method of claim 7, wherein said contaminants are configured to react with said desiccant so as to alter a hysteresis window of the at least one MEMS device adjacent to said desiccant.

10. The method of claim 1, wherein said contaminants are selected from the group consisting of fluorine-containing compounds, carbon-containing compounds and water.

11. The method of claim 1, wherein said MEMS devices are interferometric modulators.

12. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:

providing a transparent substrate with an array of MEMS devices formed thereon;

sealing said transparent substrate to a backplate to form a package;

providing a desiccant within the package;

identifying at least one MEMS device in the array of MEMS devices exhibiting a desiccant pattern, wherein the desiccant pattern is identified by a time delay between the at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state; and

if the time delay is between about 1 μ

s to about 20 μ

s, removing voltage-changing contaminants from the at least one MEMS device in the array, wherein removing voltage-changing contaminants comprises baking for between about 10 minutes and about 3 hours.

13. The method of claim 12, wherein baking comprises heating the display device to less than about 120°

C.

14. The method of claim 12, wherein the array of MEMS devices comprises an interferometric modulator (“

IMOD”

).

15. The method of claim 12, wherein the voltage-changing contaminants comprise at least one selected from the group consisting of fluorine-containing compounds carbon-containing compounds and water.

16. The method of claim 12, wherein the backplate comprises a desiccant configured to react with the voltage-changing contaminants so as to alter a release voltage of the at least one MEMS device in the array.

17. The method of claim 12, wherein the voltage changing contaminants result in the desiccant pattern.

18. A method for manufacturing a microelectromechanical (MEMS) display device, comprising:

providing a transparent substrate with an array of MEMS devices formed thereon;

sealing said transparent substrate to a backplate to form a package, wherein the backplate comprises one or more holes, and wherein a desiccant is located within the package;

identifying a time delay between at least one MEMS device and the remaining MEMS devices within the array when the array of MEMS devices transition from an actuated state to a relaxed state; and

after forming the package, if the time delay is between about 1 μ

s to about 20 μ

s, heating the package at less than about 200°

C. for a predetermined length of time sufficient to allow contaminants in the package to escape through the one or more holes, wherein the predetermined length of time is between about 10 minutes and about 3 hours.

19. The method of claim 18, wherein the MEMS display device comprises an interferometric modulator (“

IMOD”

).

20. The method of claim 18 further comprising sealing the one or more holes.

21. The method of claim 18, wherein the offset voltage in the at least one MEMS device is produced by an interfering member within the package configured to interfere with operation of the at least one MEMS device.

22. The method of claim 21, wherein the interfering member comprises the desiccant.