Semiconductor device
First Claim
1. The semiconductor device comprising on a substrate, a first electrode for injecting electrons:
- a second electrode for injecting holes;
a light emitting unit electrically connected to the first and second electrodes and emitting light by being injected with the electrons and holes by applying voltages to both electrodes;
a mirror having a function of reflecting the light emitted from the light emitting unit,wherein the light emitting unit includes a thin film installed on the substrate and a first insulating film having a first permittivity, which is installed on the thin film,the mirror is formed by periodically and alternately disposing a plurality of second insulating films having a second permittivity different from the first permittivity and a plurality of third insulating films having a third permittivity different from the second permittivity on the first insulating film to be opposed to each other by a predetermined gap,the film thickness of the thin film is thinner than those of the first and second electrodes, andwherein the thin film, and both the first electrode and the second electrode are made of a IV-group semiconductor.
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Accused Products
Abstract
There are a silicon laser device having a IV-group semiconductor such as silicon or germanium equivalent to the silicon as a basic constituent element on a substrate made of the silicon, and the like by a method capable of easily forming the silicon laser device by using a general silicon process, and a manufacturing method thereof. The silicon laser device is an ultrathin silicon laser that includes a first electrode unit injecting electrons, a second electrode unit injecting holes, a light emitting unit electrically connected to the first electrode unit and the second electrode unit, wherein the light emitting unit is made of single-crystal silicon and has a first surface (top surface) and a second surface (bottom surface) opposed to the first surface, a waveguide made of a first dielectric, which is disposed in the vicinity of the light emitting unit, by setting surface directions of the first and second surfaces as a surface (100) and thinning a thickness of the light emitting unit in a direction perpendicular to the first and second surfaces, and a mirror formed by alternately adjoining the first dielectric and a second dielectric.
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Citations
11 Claims
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1. The semiconductor device comprising on a substrate, a first electrode for injecting electrons:
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a second electrode for injecting holes; a light emitting unit electrically connected to the first and second electrodes and emitting light by being injected with the electrons and holes by applying voltages to both electrodes; a mirror having a function of reflecting the light emitted from the light emitting unit, wherein the light emitting unit includes a thin film installed on the substrate and a first insulating film having a first permittivity, which is installed on the thin film, the mirror is formed by periodically and alternately disposing a plurality of second insulating films having a second permittivity different from the first permittivity and a plurality of third insulating films having a third permittivity different from the second permittivity on the first insulating film to be opposed to each other by a predetermined gap, the film thickness of the thin film is thinner than those of the first and second electrodes, and wherein the thin film, and both the first electrode and the second electrode are made of a IV-group semiconductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. The semiconductor device comprising on a substrate, a first electrode for injecting electrons;
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a second electrode for injecting holes; a light emitting unit electrically connected to the first and second electrodes and emitting light by being injected with the electrons and holes by applying voltages to both electrodes; a mirror having a function of reflecting the light emitted from the light emitting unit, wherein the light emitting unit includes a thin film installed on the substrate and a first insulating film having a first permittivity, which is installed on the thin film, the mirror is formed by periodically and alternately disposing a plurality of second insulating films having a second permittivity different from the first permittivity and a plurality of third insulating films having a third permittivity different from the second permittivity on the first insulating film to be opposed to each other by a predetermined gap, the film thickness of the thin film is thinner than those of the first and second electrodes, and wherein the light emitting unit is installed between the first electrode and the second electrode which are installed to be opposed to each other, the mirror is installed in a first direction on the light emitting unit parallel to the first and second electrodes, and a laser beam emitted from the light emitting unit and amplified by the mirror is outputted in the first direction.
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10. The semiconductor device further comprising:
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on a substrate, a first electrode for injecting electrons; a second electrode for injecting holes; a light emitting unit electrically connected to the first and second electrodes and emitting light by being injected with the electrons and holes by applying voltages to both electrodes; a mirror having a function of reflecting the light emitted from the light emitting unit, wherein the light emitting unit includes a thin film installed on the substrate and a first insulating film having a first permittivity, which is installed on the thin film, the mirror is formed by periodically and alternately disposing a plurality of second insulating films having a second permittivity different from the first permittivity and a plurality of third insulating films having a third permittivity different from the second permittivity on the first insulating film to be opposed to each other by a predetermined gap, the film thickness of the thin film is thinner than those of the first and second electrodes, and an opening portion having a film thickness thinner than the film thickness of the substrate, which is formed on a second main surface of the substrate opposed to a first main surface of the substrate on which the light emitting unit is installed, wherein the opening portion is disposed so that at least a part of the opening portion exists on a virtual line on which a region where the light emitting unit is installed extends to the substrate. - View Dependent Claims (11)
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Specification