Packaging for an interferometric modulator with a curved back plate
First Claim
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1. An electronic device, comprising:
- a substrate comprising a first surface and a second surface, wherein the second surface is generally flat;
an array of interferometric modulators formed on the first surface of the substrate;
a back-plate sealed over the array in an ambient environment and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate; and
wherein a portion of at least one of the interior surface or the exterior surface is curved relative to the second surface of the substrate.
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Abstract
A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.
60 Citations
20 Claims
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1. An electronic device, comprising:
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a substrate comprising a first surface and a second surface, wherein the second surface is generally flat; an array of interferometric modulators formed on the first surface of the substrate; a back-plate sealed over the array in an ambient environment and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate; and wherein a portion of at least one of the interior surface or the exterior surface is curved relative to the second surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 20)
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9. An electronic device, comprising:
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a substrate comprising a first surface and a second surface, wherein the second surface is generally flat; an array of interferometric modulators formed on the first surface of the substrate; a back-plate sealed over the array in an ambient environment and having an interior surface and an exterior surface, the interior surface of the back-plate facing the array with a gap therebetween, the exterior surface facing away from the substrate; and wherein a distance between the interior surface of the back-plate and the second surface of the substrate varies across the substrate. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification