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Methods and apparatus for measuring thickness of etching residues on a substrate

  • US 7,817,289 B2
  • Filed: 07/23/2008
  • Issued: 10/19/2010
  • Est. Priority Date: 07/23/2007
  • Status: Expired due to Fees
First Claim
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1. A method of determining a thickness of a residue layer on a substrate comprising:

  • performing a first set of optical scatterometry measurements on the substrate after an etching procedure;

    performing a second set of optical scatterometry measurements on the substrate after a post-etch cleaning procedure;

    calculating a difference measurement between the first set and second set of optical scatterometry measurements; and

    determining an initial thickness measurement of the residue layer based on the difference measurement by applying a first dispersion model.

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