Non-peripherals processing control module having improved heat dissipating properties

• US 7,817,412 B2
• Filed: 08/03/2007
• Issued: 10/19/2010
• Est. Priority Date: 10/22/2002
• Status: Expired due to Term

• Current Assignee: ATD Ventures, LLC
• Original Assignee: Jason A. Sullivan
• Inventors: Sullivan, Jason A.
• Primary Examiner(s): Duong, Hung V
• Application Number:
  US11/833,852
• Publication Number:
  US 20080013270A1
• Time in Patent Office: 1,173 Days
• Field of Search: 395/800, 364/200, 710101-102, 710/129, 710304-305, 712/36, 700/215, 361679-687, 361724-727
• US Class Current: 361/679.33
• CPC Class Codes: G06F 1/16 Constructional details or arrangements
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H05K 5/02 Details

Abstract

The present invention features a non-peripherals-based processing control unit having an encasement module that is very small and durable compared to conventional computer encasement structures. The process control unit is capable of being incorporated into various devices and/or environments, of accepting applied and impact loads, of functioning as a load bearing structure, as well as being able to be processed coupled together with one or more processing control units to provide scaled processing power. The processing control unit of the present invention further features a unique method of cooling using natural convection, as well as utilizing known cooling means, such as liquid or thermoelectric cooling.

Claims

1. An encasement for a computer processing control unit comprising:

a main support chassis containing therein a computer processing control unit and means for supporting a computer component, wherein said main support chassis is a non-peripherally based chassis; and

a dynamic back plane selectively coupled to the main support chassis, wherein the dynamic back plane provides support for one or more computing components, and wherein the dynamic back plane comprises one or more ports for connection to said components.

2. The encasement of claim 1, further comprising means for cooling said encasement.

3. The encasement of claim 2, wherein said means for cooling comprises a natural convection cooling system.

4. The encasement of claim 1, wherein said encasement comprises at least one of:

(i) a metal;

(ii) a metal alloy;

(iii) a polymer;

(iv) graphite; and

(v) a non-metallic material.

5. An encasement for a computer processing control unit comprising:

a main support chassis containing therein a computer proccssing control unit and means for supporting a computer component wherein the main support chassis comprises one or more wall supports and one or more junction centers, wherein a gap is created and maintained between said wall supports and said one or more computing components as supported within said encasement to facilitate air flow therebetween; and

a dynamic back plane selectively coupled to the main support chassis, wherein the dynamic back plane provides support for said one or more ports for connection to said components, and wherein the dynamic back plane comprises one or more ports for connection to said components.

6. A load-bearing, processing member of a device, comprising:

an encasement for housing a processing control unit, the encasement having a plurality of wall supports configured to support an external load, wherein the plurality of wall supports is built with at least one radius; and

an interchangeable, dynamic backplane operably connected to the processing control unit, and occupying a portion of at least one of the plurality of wall supports.

7. The device of claim 6, wherein the at least one radius is calculated to provide increased strength and load bearing structure to the plurality of wall supports.

8. The device of claim 6, wherein the encasement comprises a width, a height, and a length of generally symmetrical dimension.

9. The device of claim 6, further comprising means for cooling.

10. The device of claim 9, wherein the means for cooling comprises at least one of:

(i) a natural convection cooling system;

(ii) a liquid cooling system;

(iii) a cooling coil and a liquid; and

(iv) solid state heat pumps.

11. The device of claim 6, wherein said encasement comprises at least one of:

(i) a metal;

(ii) a metal alloy;

(iii) a polymer;

(iv) graphite; and

(v) a non-metallic material.

12. A load-bearing, processing member of a device, comprising:

an encasement for housing a processing control unit, said encasement having a plurality of wall supports configured to support an external load wherein the encasement further comprises an electrical charge to repel particles and debris from said encasement; and

an interchangeable, dynamic backplane operably connected to the processing control unit, an occupying a portion of at least one of the plurality of wall supports.

13. An interchangeable, dynamic backplane for a computer processing unit, the backplane comprising:

an attachment feature for selectively coupling the backplane to a main support chassis of the computer processing unit, wherein the main support chassis is a non-peripheral based encasement;

means for establishing a connection between the backplane and a bus of the computer processing unit; and

means for establishing communication between the bus of the computer processing unit and an external device, wherein the means for establishing communication is selected based on a connection format of the external device.

14. The dynamic backplane of claim 13, wherein the means for establishing communication includes a wireless interface.

15. The dynamic backplane of claim 13, wherein the means for establishing communication includes at least one port.

16. The dynamic backplane of claim 13, wherein the means for establishing communication includes a data manipulation system.

17. The dynamic backplane of claim 13, wherein the external device is another computer processing unit.