Disc resonator gyroscope fabrication process requiring no bonding alignment
First Claim
1. A method of fabricating a resonant vibratory sensor, comprising the steps of:
- providing a fabricated baseplate wafer having present thereon at least one locating mark;
observing a location of said at least one locating mark;
bonding to said fabricated baseplate wafer a blank resonator wafer;
affixing to said otherwise blank resonator wafer at least one locating mark at a location defined relative to said at least one locating mark that was observed on said fabricated baseplate; and
fabricating the resonator structure in said blank resonator wafer in relation to said at least one locating mark affixed to said blank resonator wafer;
thereby fabricating a resonant vibratory sensor.
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Accused Products
Abstract
A method of fabricating a resonant vibratory sensor, such as a disc resonator gyro. A silicon baseplate wafer for a disc resonator gyro is provided with one or more locating marks. The disc resonator gyro is fabricated by bonding a blank resonator wafer, such as an SOI wafer, to the fabricated baseplate, and fabricating the resonator structure according to a pattern based at least in part upon the location of the at least one locating mark of the fabricated baseplate. MEMS-based processing is used for the fabrication processing. In some embodiments, the locating mark is visualized using optical and/or infrared viewing methods. A disc resonator gyroscope manufactured according to these methods is described.
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Citations
7 Claims
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1. A method of fabricating a resonant vibratory sensor, comprising the steps of:
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providing a fabricated baseplate wafer having present thereon at least one locating mark; observing a location of said at least one locating mark; bonding to said fabricated baseplate wafer a blank resonator wafer; affixing to said otherwise blank resonator wafer at least one locating mark at a location defined relative to said at least one locating mark that was observed on said fabricated baseplate; and fabricating the resonator structure in said blank resonator wafer in relation to said at least one locating mark affixed to said blank resonator wafer; thereby fabricating a resonant vibratory sensor. - View Dependent Claims (2, 3)
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4. A resonant vibratory sensor, comprising:
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a fabricated baseplate wafer having present thereon at least one locating mark in a specified location; and a resonator wafer bonded to said fabricated baseplate, said resonator wafer comprising at least one locating mark affixed to said otherwise blank resonator wafer at a location defined relative to said at least one locating mark of said fabricated baseplate, and a structure fabricated according to a pattern based at least in part upon said location of said at least one locating mark affixed to said otherwise blank resonator wafer. - View Dependent Claims (5, 6, 7)
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Specification