Process condition sensing wafer and data analysis system
First Claim
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1. A device for monitoring processing conditions to be inserted by a robot hand into a sealed chamber, the device comprising:
- a first member comprising sensors;
a second member comprising electronics;
a conductive cable or conductors connecting the first and second members, wherein the first and second members fit into or onto a robot hand or hands, and wherein the device can be extended to a second position by the robot hand such that the first member is inside the sealed chamber and the second circular member is outside the chamber, thereby not subjecting the electronics of the second member to the conditions within the chamber.
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Abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
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Citations
15 Claims
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1. A device for monitoring processing conditions to be inserted by a robot hand into a sealed chamber, the device comprising:
- a first member comprising sensors;
a second member comprising electronics;
a conductive cable or conductors connecting the first and second members, wherein the first and second members fit into or onto a robot hand or hands, and wherein the device can be extended to a second position by the robot hand such that the first member is inside the sealed chamber and the second circular member is outside the chamber, thereby not subjecting the electronics of the second member to the conditions within the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
- a first member comprising sensors;
Specification