Recycling of electrochemical-mechanical planarization (ECMP) slurries/electrolytes
First Claim
Patent Images
1. A method of reclaiming a slurry comprising contacting an electrochemical-mechanical planarization slurry with an immiscible, non-aqueous phase acidic solvent and extracting metal ions from the slurry into said immiscible solvent to form a treated slurry for further use in an electrochemical mechanical planarization (ECMP) process.
6 Assignments
0 Petitions
Accused Products
Abstract
A method, process and system for the recycling of electrochemical-mechanical planarization slurries/electrolytes as they are used in the back end of line of the semiconductor wafer manufacturing process is disclosed. The method, process and system includes with the removal of metal ions from slurries using ion exchange media and/or electrochemical deposition.
21 Citations
18 Claims
- 1. A method of reclaiming a slurry comprising contacting an electrochemical-mechanical planarization slurry with an immiscible, non-aqueous phase acidic solvent and extracting metal ions from the slurry into said immiscible solvent to form a treated slurry for further use in an electrochemical mechanical planarization (ECMP) process.
Specification