Method for forming fine copper particle sintered product type of electric conductor having fine shape, and process for forming copper fine wiring and thin copper film by applying said method

• US 7,820,232 B2
• Filed: 05/13/2004
• Issued: 10/26/2010
• Est. Priority Date: 05/16/2003
• Status: Active Grant

• Current Assignee: Harima Chemicals Incorporated
• Original Assignee: Harima Chemicals Incorporated
• Inventors: Hata, Noriaki, Matsuba, Yorishige, Izumitani, Akihito, Itoh, Daisuke
• Primary Examiner(s): Barr; Michael
• Assistant Examiner(s): Schiro; Ryan
• Application Number:
  US10/556,871
• Publication Number:
  US 20060210705A1
• Time in Patent Office: 2,357 Days
• Field of Search: 427/428.13, 427/96.1
• US Class Current: 427/96.1
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H05K 2201/0257 Nanoparticles inks comprising nanoparticles H05K1/097
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/1131 Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
• CPC Class Codes: H05K 2203/1157 Using means for chemical reduction
• CPC Class Codes: H05K 2203/122 Organic non-polymeric compounds, e.g. oil, wax, thiol using solvent H05K2203/0783
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/105 by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
• CPC Class Codes: H05K 3/1283 After-treatment of the printed patterns, e.g. sintering or curing methods

Abstract

The present invention provides a process for forming a copper fine particle sintered product type of a fine-shaped electric conductor showing superior electroconductivity, which comprises steps of drawing a fine pattern with the use of a dispersion containing the copper fine particles having a surface oxide film layer, conducting a treatment for reducing the copper fine particles with the surface oxide film layer or copper oxide fine particles included in the pattern at a comparatively low temperature, and baking the resultant copper fine particles. Specifically, the process carries out the processes of; applying a dispersion containing the copper fine particles having the surface oxide film layer thereon or the copper oxide fine particles with an average particle diameter of 10 μm or smaller onto a substrate; and then performing a series of the heat treatment steps of heating the particles in the coated layer at temperature of 350° C. or lower under an atmosphere containing a vapor and a gas of a compound having reducibility to reduce the oxide film by a reduction reaction which used the compound having reducibility as a reducing agent, subsequently repeating a heat treatment combining an oxidizing treatment of a short time with a re-reducing treatment, and sintering the resultant copper fine particles with each other to form a layer of the sintered product.

Claims

1. A process for forming a copper-based fine pattern consisting of a sintered product layer made of copper nano-particles sintered with each other, which process comprises the steps of:

drawing a layer coated on a substrate, which layer has a fine pattern, by using a dispersion containing copper oxide nano-particles or copper nano-particles provided with a surface oxide film layer, which particles have an average particle diameter of 1 to 100 nm, together with a dispersion medium thereof and

subjecting the copper oxide nano-particles or the copper nano-particles provided with the surface oxide film layer contained in the coated layer drawn by using the dispersion to a reducing treatment, wherein the copper oxides or surface oxide film layer are reduced at a heating temperature selected form the range of 180°

C. to 300°

C. by using an organic compound having reducing activity, and further a baking treatment wherein the copper nano-particles resulting from the reducing treatment are baked at the heating temperature selected from the range of 180°

C. to 300°

C. to form a sintered product layer made of the copper nano-particles in the fine pattern,

wherein the sintered product layer made of copper nano-particles that is formed by the process consists of the copper nano-particles sintered with each other, the coated layer drawn by using the dispersion contains the dispersion medium, the dispersion medium is an organic solvent, and said reducing treatment and the baking treatment that is carried out by heating at a heating temperature selected from the range of 180°

C. to 300°

C. in single stage which is conducted by heating the copper oxide nano-particles or the copper nano-particles with the surface oxide film layer contained in the coated layer in the presence of the organic compound having reducing activity at the heating temperature selected from the range of 180°

C. to 300°

C., thereby giving rise to the action of said organic compound having reducing activity on the copper oxide nano-particles or the surface oxide film layer.

2. The process according to claim 1, wherein in the copper nano-particle with the surface oxide film layer contained in the dispersion, said surface oxide film layer comprises cuprous oxide, cupric oxide or a mixture thereof, and the nano-particle is a particle that contains metallic copper and one or more selected from the group consisting of cuprous oxide, cupric oxide and a mixture of the foregoing.

3. The process according to claim 1, wherein said organic compound having reducing activity is an organic compound having a hydroxyl group that is transformable to an oxo group (═

O) or a formyl group (—

CHO) by oxidation, or a mixture containing two or more types thereof.

4. The process according to claim 1, wherein said organic compound having reducing activity is selected from an organic compound having an alcoholic hydroxyl group, or a mixture containing two or more types thereof.

5. The process according to claim 1, wherein said organic compound having reducing activity is selected from an organic compound having two or more hydroxyl groups, or a mixture containing two or more types thereof.

6. The process according to claim 1, wherein said organic compound having reducing activity is glycerin (1,2,3-propanetriol).

7. The process according to claim 1, wherein at least one of said organic compounds having reducing activity is blended in the dispersion containing the copper oxide nano-particles or the copper nano-particles provided with the surface oxide film layer.

8. The process according to claim 1, wherein in the step of the reducing treatment, at least one of said organic compounds having reducing activity is vaporized to act on the coated layer having the fine pattern, in vapor phase containing at least vapor of said organic compound having reducing activity.

9. The process according to claim 1, wherein in the coated layer having the fine pattern drawn on the substrate,

a minimum line width of the fine pattern is selected from a range of 0.5 to 200 μ

m, and a minimum space width between adjacently lying lines of the fine pattern is selected from a range of 0.5 to 200 μ

m, and

the average particle diameter of the copper oxide nano-particles or the copper nano-particles provided with the surface oxide film layer contained in the dispersion is selected from the values of 1/10 or less of the minimum line width and the minimum space width of the fine pattern.

10. The process according to claim 1, wherein the step of drawing is conducted by a screen-printing method, an ink-jet method or a transferring method.

11. The process according to claim 1 , wherein in the copper-based fine pattern to be formed on the substrate,

a minimum thickness of the copper-based fine pattern is selected from a range of 0.1 to 20 pm, and

the average particle diameter of the copper oxide nano-particles or the copper nano-particles with the surface oxide film layer contained in the dispersion is selected from values of 1/10 or less of the minimum thickness thereof.

18. The process according to claim 1, wherein the copper-based fine pattern is a copper-based fine pattern for wiring of a plated circuit.

26. The process according to claim 1,

Wherein in the step of drawing the layer coated on the substrate, which layer has the fine pattern,

a dispersion containing copper oxide nano-particles or copper nano-particles provided with a surface oxide film layer, which particles have an average particle diameter of 1 to 20 nm, together with the dispersion medium thereof is used as the dispersion, so that the cupper nano-particles resulting from the reducing treatment have an average particle diameter of 1 to 20 nm.

27. The process according to claim 8, wherein in the step of the reducing treatment, the heating temperature is selected from the range of 250°

C. to 300°

C.

28. The process according to claim 7, wherein in the step of the reducing treatment, the heating temperature is selected from the range of 250°

C. to 300°

C.

12. A process for forming a copper thin-film layer consisting of a sintered product layer made of copper fine particles sintered with each other, wherein the process comprises the steps of:

drawing a layer coated on a substrate by using a dispersion containing copper oxide fine particles or copper fine particles provided with a surface oxide film layer, which particles have an average particle diameter of 10 μ

m or less, together with a dispersion medium thereof and

subjecting the copper oxide fine particles or the copper fine particles with the surface oxide film layer contained in the coated layer drawn by using the dispersion to a reducing treatment wherein the copper oxides or the surface oxide film layer are reduced at a heating temperature selected form the range of 250°

C. to 350°

C. by using an organic compound having reducing activity, and further to a baking treatment wherein the copper fine particles resulting from the reducing treatment are baked at the heating temperature selected form the range of 250°

C. to 350°

C. to form a sintered product layer made of the copper fine particles,

wherein the sintered product layer made of copper fine particles sintered with each other consists of the copper fine particles sintered with each other, the coated layer drawn by using the dispersion contains the dispersion medium, the dispersion medium is an organic solvent, said reducing treatment and the baking treatment comprise the following two steps that are executed sequentially in a single process at the heating temperature selected from the range of 250°

C. to 350°

C.;

a first treatment step of heating the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer contained in the coated layer for duration of 1 min. to 15 min. at the heating temperature selected from the range of 250°

C. to 350°

C. in the presence of an organic compound having reducing activity to give rise to the action of said organic compound having reducing activity thereon, and thereby reducing the copper oxides composing the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer to provide copper fine particles; and

a second treatment step of subjecting said copper fine particles obtained in the first treatment step to a combined treatment of oxidation/re-reduction at least one time, which includes a stage of subjecting the copper fine particles to a surface oxidization treatment by heating for 30 seconds or shorter at the heating temperature selected from the range of 250°

C. to 350°

C. under an atmosphere containing oxygen to give rise to the action of oxygen thereon, and then a stage of subjecting the copper fine particles, which have undergone the surface oxidization treatment, to a re-reduction treatment by heating the particles for 30 seconds or longer but 300 seconds or shorter at the heating temperature selected from the range of 250°

C. to 350°

C. under an atmosphere containing gas or vapor of said organic compound having reducing activity to give rise to the action of said organic compound having reducing activity thereon.

13. The process according to claim 12, wherein the copper thin-film layer is made of the sintered product layer made of the copper fine particles being shaped into a predetermined plane-view pattern, wherein in said sintered product layer made of the copper fine particles, a minimum film thickness is selected from a range of 0.1 to 20 μ

m, a maximum film thickness is selected from a range of 100 μ

m or smaller, and the minimum line width of the plane-view pattern is selected from a range of 0.5 to 200 μ

m, and the average particle diameter of the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer is selected within ½

of said minimum film thickness and within 1/10 of said minimum line width of predetermined plane-view pattern.

14. The process according to claim 13, wherein said organic compound having reducing activity used in said first treatment step and the re-reduction treatment stage of said second treatment step is an organic compound having a hydroxyl group that is transformable to an oxo group (═

O) or a formyl group (—

CHO) by oxidation, or a mixture containing two or more types thereof.

15. The process according to claim 13, wherein said organic compound having reducing activity used in said first treatment step and the re-reduction treatment stage of said second treatment step is a polyvalent alcohol compound having two or more hydroxyl groups in a molecule, or a mixture containing two or more types thereof.

16. The process according to claim 13, wherein said organic compound having reducing activity used in said first treatment step and the re-reduction treatment stage of said second treatment step is any one of glycerin (1,2,3-propanetriol), ethylene glycol (1,2-ethanediol), propylene glycol (1,2-propanediol) and 1,3-propanediol.

17. The process according to claim 13, wherein a dispersion medium contained in the dispersion containing the copper oxide fine particles or the copper fine particles with the surface oxide film layer is an alcoholic compound having a melting point of 10°

C. or lower, and a hydroxyl group which is transformable to an oxo group (═

O) or a formyl group (—

CHO) by oxidation.

19. The process according to claim 12, wherein the copper thin-film layer is formed for a fine copper-based wiring pattern.

20. The process according to claim 13, wherein in the copper fine particles with the surface oxide film layer contained in the dispersion, said surface oxide film layer comprises cuprous oxide, cupric oxide or the mixture thereof, and the fine particle is a particle in the shape of mixture containing metallic copper and one or more selected from the group consisting of cuprous oxide, cupric oxide and a mixture of the foregoing.

21. The process according to claim 12,

wherein said copper oxide fine particles or copper fine particles provided with a surface oxide film layer, which particles have an average particle diameter of 10 μ

m or less, is copper oxide nano-particles or copper nano-particles provided with a surface oxide film layer, which particles have an average particle diameter of 1 to 100 nm.

29. The process according to claim 12, wherein the dispersion medium is an organic solvent having a melting point of 10°

C. or lower and a boiling point selected form the range of 100°

C. to 300°

C.

22. A process for forming a copper thin-film layer consisting of a product layer made of copper fine particles sintered with each other, wherein the process comprises the steps of:

drawing a layer coated on a substrate by using a dispersion containing copper oxide fine particles or copper fine particles provided with a surface oxide film layer, which particles have an average particle diameter of 10 μ

m or less, together with a dispersion medium thereof and subjecting the copper oxide fine particles or the copper fine particles with the surface oxide film layer contained in the coated layer drawn by using the dispersion to a reducing treatment wherein the copper oxides or the surface oxide film layer are reduced by using a hydrogen molecule at a heating temperature selected from the range of 250°

C. to 350°

C., and further to a baking treatment wherein the copper fine particles resulting from the reducing treatment are baked at the heating temperature selected from the range of 250°

C. to 350°

C. to form a sintered product layer of the copper fine particles,

wherein the sintered product layer made of copper fine particles sintered with each other consists of the copper fine particles sintered with each other,

the coated layer drawn by using the dispersion contains the dispersion medium,

the dispersion medium is an organic solvent, said reducing treatment and the baking treatment comprise the following two steps that are executed sequentially in a single process at the heating temperature selected from the range of 250°

C. to 350°

C.;

a first treatment step of heating the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer contained in the coated layer for duration of 1 min. to 15 min. at the heating temperature selected form the range of 250°

C. to 350°

C. in the presence of the hydrogen molecule to give rise to the action of said hydrogen molecule thereon, and thereby reducing the copper oxides composing the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer to provide copper fine particles; and

a second treatment step of subjecting said copper fine particles obtained in the first treatment step to a combined treatment of oxidation/re-reduction at least one time, which includes a stage of subjecting the copper fine particles to a surface oxidization treatment by heating for 30 seconds or shorter at the heating temperature selected from the range of 250°

C. to 350°

C. under an atmosphere containing oxygen to give rise to the action of oxygen thereon, and then a stage of subjecting the copper fine particles, which have undergone the surface oxidization treatment, to a re-reduction treatment by heating the particles for 30 seconds or longer but 300 seconds or shorter at the heating temperature selected from the range of 250°

C. to 350°

C. under an atmosphere containing said hydrogen molecule to give rise to the action of said hydrogen molecule thereon.

23. The process according to claim 22,

wherein in the copper fine particle with the surface oxide film layer contained in the dispersion, said surface oxide film layer comprises cuprous oxide, cupric oxide or the mixture thereof, and the fine particle is a particle in the shape of mixture containing metallic copper and one or more selected from the group consisting of cuprous oxide, cupric oxide and a mixture of the forgoing.

24. The process according to claim 22, wherein the copper thin-film layer is made of the sintered product layer made of the copper fine particles being shaped into a predetermined plane-view pattern,

wherein in said sintered product layer made of the copper fine particles, a minimum film thickness is selected from a range of 0.1 to 20 μ

m, a maximum film thickness is selected from a range of 100 μ

m or smaller, and the minimum line width of the plane-view pattern is selected from a range of 0.5 to 200 μ

m, and

the average particle diameter of the copper oxide fine particles or the copper fine particles provided with the surface oxide film layer is selected within ¼

of said minimum film thickness and within 1/10 of said minimum line width of predetermined plane-view pattern.

25. The process according to claim 22, wherein the copper thin-film layer is formed for a fine copper-based wiring pattern .

30. The process according to claim 22, wherein the dispersion medium is an organic solvent having a melting point of 20°

C. or lower and a boiling point selected form the range of 100°

C. to 300°

C.