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Wafer level packaging

  • US 7,820,484 B2
  • Filed: 05/13/2008
  • Issued: 10/26/2010
  • Est. Priority Date: 06/14/2002
  • Status: Expired due to Term
First Claim
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1. A method of forming contacts for an integrated circuit, comprising:

  • providing a substrate with at least one integrated circuit;

    forming a first trench in the top side of the substrate;

    forming a second trench in the back side of the substrate so that the second trench crosses the first trench to form a through via;

    inserting a conductor in the through via to form an electrical contact on both the top side and the back side;

    positioning a bond pad on the top side; and

    electrically connecting the bond pad to the conductor, wherein a trace is formed on the top side of the substrate to electrically connect the bond pad to the conductor.

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