Semiconductor device comprising a thin film transistor comprising a semiconductor thin film and method of manufacturing the same
First Claim
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1. A semiconductor device comprising:
- a first thin film transistor formed over an insulating surface, the first thin film transistor comprising;
a semiconductor film comprising at least a channel forming region;
a gate insulating film adjacent to the channel forming region; and
a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween;
a source wiring and a drain wiring electrically connected to the first thin film transistor;
a passivation film comprising a silicon nitride formed over the first thin film transistor;
a color filter formed over the passivation film, wherein a first opening is formed in the color filter;
an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, anda pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings,wherein the passivation film is interposed between the first thin film transistor and the color filter so that the drain wiring is not in contact with the color filter, andwherein the pixel electrode is in contact with a portion of the color filter in the first opening,wherein the pixel electrode overlaps with the source wiring and the drain wiring.
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Abstract
An object of the present invention is to provide a semiconductor device having high operation characteristic and reliability.
The measures taken are: A pixel capacitor is formed between an electrode comprising anodic capable material over an organic resin film, an anodic oxide film of the electrode and a pixel electrode above. Since the anodic oxide film is anodically oxidized by applied voltage per unit time at 15 V/min, there is no wrap around on the electrode, and film peeling can be prevented.
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Citations
66 Claims
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1. A semiconductor device comprising:
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a first thin film transistor formed over an insulating surface, the first thin film transistor comprising; a semiconductor film comprising at least a channel forming region; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween; a source wiring and a drain wiring electrically connected to the first thin film transistor; a passivation film comprising a silicon nitride formed over the first thin film transistor; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the passivation film is interposed between the first thin film transistor and the color filter so that the drain wiring is not in contact with the color filter, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring and the drain wiring. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device comprising:
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a first thin film transistor formed over an insulating surface, the first thin film transistor comprising; a semiconductor film comprising at least a channel forming region; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the gate insulating film, a source wiring and a drain wiring electrically connected to the first thin film transistor; a gate wiring electrically connected to the gate electrode; a passivation film comprising a silicon nitride formed over the first thin film transistor; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the second opening completely overlaps the first opening, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring, the drain wiring, and the gate wiring. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A semiconductor device comprising:
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a first thin film transistor fanned over an insulating surface, the first thin film transistor comprising; a semiconductor film comprising at least a channel forming region; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween; a source wiring and a drain wiring electrically connected to the first thin film transistor; a gate wiring electrically connected to the gate electrode; a passivation film formed over the first thin film transistor; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the passivation film is interposed between the first thin film transistor and the color filter so that the drain wiring is not in contact with the color filter, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring, the drain wiring, and the gate wiring. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A semiconductor device comprising:
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a first thin film transistor formed over an insulating surface, the first thin film transistor comprising; a semiconductor film comprising; a channel forming region; and a source region and a drain region; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the gate insulating film; a source wiring and a drain wiring electrically connected to the first thin film transistor; a passivation film comprising a silicon nitride film formed over the first thin film transistor; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the passivation film is interposed between the first thin film transistor and the color filter so that the drain wiring is not in contact with the color filter, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring and the drain wiring. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A semiconductor device comprising:
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a first thin film transistor formed over an insulating surface, the first thin film transistor comprising; a semiconductor film comprising; a channel forming region; and a source region and a drain region; a gate insulating film adjacent to the channel fowling region; and a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween; a source wiring and a drain wiring electrically connected to the first thin film transistor; a passivation film comprising a silicon nitride film formed over the first thin film transistor; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the second opening completely overlaps the first opening, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring and the drain wiring. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47, 48, 53)
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49. A semiconductor device comprising:
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a first thin film transistor comprising; a semiconductor film comprising; a channel forming region; and a source region and a drain region; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween; a source wiring and a drain wiring electrically connected to the first thin film transistor; a passivation film formed over the first thin film transistor, the passivation film comprising at least a material selected from the group consisting of silicon nitride, silicon oxide and nitrated silicon oxide; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the passivation film is interposed between the first thin film transistor and the color filter so that the drain wiring is not in contact with the color filter, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring and the drain wiring. - View Dependent Claims (50, 51, 52, 54, 55, 56, 57)
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58. A semiconductor device comprising:
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a first thin film transistor comprising; a semiconductor film comprising a channel forming region, a source region, and a drain region, the semiconductor film comprising silicon; a gate insulating film adjacent to the channel forming region; and a gate electrode adjacent to the channel forming region with the gate insulating film interposed therebetween; a source wiring and a drain wiring electrically connected to the first thin film transistor; a passivation film formed over the first thin film transistor, the passivation film comprising at least a material selected from the group consisting of silicon nitride, silicon oxide and nitrated silicon oxide; a color filter formed over the passivation film, wherein a first opening is formed in the color filter; an insulating film formed over the color filter, wherein a second opening is formed in the insulating film, and a pixel electrode formed over the insulating film and electrically connected to the drain wiring through the first and second openings, wherein the second opening completely overlaps the first opening, and wherein the pixel electrode is in contact with a portion of the color filter in the first opening, wherein the pixel electrode overlaps with the source wiring and the drain wiring. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66)
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Specification