Semiconductor device and method for producing the same

• US 7,821,121 B2
• Filed: 04/02/2008
• Issued: 10/26/2010
• Est. Priority Date: 04/25/2007
• Status: Expired due to Fees

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Miyake, Takashi, Urakawa, Shin-ichi, Yoshizawa, Tetsuo
• Primary Examiner(s): Tran; Thien F
• Application Number:
  US12/061,097
• Publication Number:
  US 20080265355A1
• Time in Patent Office: 937 Days
• Field of Search: 257/432, 257/433, 257/698
• US Class Current: 257/698
• CPC Class Codes: H01L 21/566 Release layers for moulds, e.g. release layers, layers against residue during moulding
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01088 : Radium [Ra]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/18 : Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H05K 2201/09181 : Notches in edge pads
• CPC Class Codes: H05K 3/0052 : Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/403 : Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/42 : Plated through-holes or plated via connections

Abstract

In a semiconductor device which has through holes in an end face, in which a semiconductor element is fixedly mounted on a face of a substrate which has a wiring pattern, which is conductive to the wiring portion formed in the through hole, in at least one face, in which electrodes of the semiconductor element are electrically connected to the wiring pattern, and in which the face of the substrate which has the semiconductor element is coated with a resin, the through hole has a through hole land with a width of 0.02 mm or more, which is conductive to the wiring portion, in a substrate face, and the wiring portion and the through hole land are exposed.

Claims

1. A semiconductor device, comprising:

a semiconductor element fixedly mounted on a substrate having a plurality of through holes provide on at least one edge of the substrate,

wherein an electrode of the semiconductor element is to be electrically connected to a wiring pattern via each through hole,

wherein each through hole has, on a surface of the substrate, an exposed through hole land of a width of 0.02 mm or more,

wherein, for each through hole, a width X of the through hole land is given by;

X≦

(P−

A−

B)/2,

where A is a through hole diameter, B is a distance between through hole lands, and P is a through hole pitch,

wherein, for each through hole, the semiconductor element is coated with a resin that extends to an edge of the through hole land without covering the exposed through hole land and without covering the through hole, and

wherein, for each through hole, the resin is shaped using a mold with a convex portion that presses the through hole at an area extending over the width of the exposed through hole land, so that no resin flows into the through hole during processing of the resin.

2. The semiconductor device according to claim 1, wherein the resin is light transmitting resin, and the semiconductor element is a photoelectric conversion element.

3. The semiconductor device according to claim 1, wherein the resin covering the semiconductor element has a flat upper plane.