Methods and apparatus for polishing a semiconductor wafer

• US 7,824,244 B2
• Filed: 05/30/2007
• Issued: 11/02/2010
• Est. Priority Date: 05/30/2007
• Status: Expired due to Fees

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Eisenstock, Gregory, Thomas, John Christopher
• Primary Examiner(s): ROSE, ROBERT A
• Application Number:
  US11/807,783
• Publication Number:
  US 20080299871A1
• Time in Patent Office: 1,252 Days
• Field of Search: 451/6, 451/5, 451/11, 451/168, 451/173
• US Class Current: 451/6
• CPC Class Codes: B24B 21/06 involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground B24B21/12 takes precedence
• CPC Class Codes: B24B 37/005 Control means for lapping machines or devices

Abstract

Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.

Claims

1. An apparatus, comprising:

a base on which a substrate may be releasably coupled;

a moving abrasive member located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and

a plurality of actuators, at least two of which are independently controllable, and at least one of the plurality of actuators is a fluid controlled actuator, located with respect to the base and the moving abrasive member such that a corresponding plurality of pressure zones are defined to provide pressure between the moving abrasive member and the top surface of the substrate,

wherein the at least one fluid controlled actuator includes a self compensating hydrostatic pad defined by a volume of relatively higher pressure fluid in communication with one of the moving abrasive member and a bottom surface of the substrate such that the hydrostatic pad is operable to vary the pressure between the moving abrasive member and the top surface of the substrate in the associated pressure zone.

2. The apparatus of claim 1, wherein the actuators include at least one fluid controlled actuator operable to vary the pressure between the moving abrasive member and the top surface of the substrate in an associated one of the pressure zones as a function of a pressure of supplied fluid thereto.

3. The apparatus of claim 1, wherein the hydrostatic pad is directly or indirectly engageable with a surface of the moving abrasive member opposite the contact surface such that the hydrostatic pad is operable to urge the moving abrasive member against the top surface of the substrate as a function of the pressure of the supplied fluid.

4. The apparatus of claim 2, wherein at least one of the fluid controlled actuators includes a plate and a plurality of bores through the plate communicating at first ends thereof with the supplied fluid and at second ends thereof with one of the moving abrasive member and a bottom surface of the substrate such that the supplied fluid is operable to vary the pressure between the moving abrasive member and the top surface of the substrate in the associated pressure zone as a function of the pressure of the supplied fluid within the bores.

5. The apparatus of claim 4, wherein the second ends of the bores are in communication with a surface of the moving abrasive member opposite the contact surface such that the supplied fluid is operable to urge the moving abrasive member against the top surface of the substrate as a function of the pressure of the supplied fluid.

6. The apparatus of claim 1, wherein the moving abrasive member comprises a moving belt.

7. The apparatus of claim 1, further comprising at least one optical detector circuit operable to monitor a thickness of the substrate in at least one of the pressure zones.

8. The apparatus of claim 7, wherein:

a bottom surface of the substrate opposite the top surface is coupled to a top surface of the base; and

the base includes at least one aperture extending to the top surface thereof and located in the at least one pressure zone such that the optical detector circuit is operable to monitor the thickness of the substrate via the bottom surface thereof.

9. The apparatus of claim 8, wherein the base includes a plurality of apertures extending to the top surface thereof, at least one aperture located in each pressure zone.

10. The apparatus of claim 9, wherein the optical detector circuit includes a plurality of detectors, at least one of the plurality of detectors being operable to monitor the thickness of the substrate via the bottom surface thereof through a respective one of the apertures in respective ones of the pressure zones.

11. The apparatus of claim 9, wherein the optical detector circuit is operable to move in registration with respective ones of the apertures in order to monitor the thickness of the substrate via the bottom surface thereof through in respective ones of the pressure zones.

12. The apparatus of claim 7, further comprising a processor operating under control of a program and producing at least first and second signals in response to substrate thickness information provided by the optical detector circuit, wherein each of the first and second signals is operable to control the respective pressures provided by respective ones of the plurality of actuators.

13. The apparatus of claim 12, wherein the processor is operable to compute from the thickness information at least one of:

a rate at which material is removed from the substrate by the moving abrasive member;

an amount of material that has been removed from the substrate by the moving abrasive member; and

a variation in thickness of the substrate.

14. The apparatus of claim 6, wherein the moving belt includes a micro-replicated pattern of micron-sized posts on the contact surface thereof.

15. The apparatus of claim 1, wherein relative sizes of the contact surface and the top surface of the substrate are such that sub-aperture finishing is achieved.

20. The apparatus of claim 1, wherein the self compensating hydrostatic pad includes a movable member situated between first and second pressure zones, the second pressure zone including the volume of fluid, comprising the hydrostatic pad, in communication with one of the moving abrasive member and a bottom surface of the substrate.

21. The apparatus of claim 20, wherein the self compensating hydrostatic pad includes at least one orifice extending between the first and second pressure zones to permit fluid to flow from the first pressure zone to the second pressure zone.

22. The apparatus of claim 20, wherein the at least one orifice extends through the movable member from the first pressure zone to the second pressure zone.

23. The apparatus of claim 20, wherein the movable member is spaced away from the one of the moving abrasive member and the bottom surface of the substrate, thereby forming a gap therebetween through which the fluid flows from the second pressure zone.

24. The apparatus of claim 23, wherein:

the gap varies as the spacing between the movable member and the one of the moving abrasive member and the bottom surface of the substrate varies; and

the pressure in the second pressure zone decreases below the pressure in the first pressure zone as the gap increases, and the pressure difference causes the moving member to advance and reduce the gap and equalize the pressure between the first and second pressure zones, such that the hydrostatic pad is self compensating and operates to vary the pressure between the moving abrasive member and the top surface of the substrate in the associated pressure zone.

16. A method, comprising:

removing material from a top surface of a substrate using a moving abrasive member; and

adjusting respective pressures of the movable abrasive member against the top surface of the substrate in corresponding pressure zones,

wherein adjusting the respective pressures is achieved by a self compensating hydrostatic pad defined by a volume of relatively higher pressure fluid in communication with one of the moving abrasive member and a bottom surface of the substrate such that the pad is operable to vary the pressure between the moving abrasive member and the top surface of the substrate in the associated pressure zone.

17. The method of claim 16, further comprising optically sensing one or more thicknesses of the substrate and adjusting the respective pressures in response thereto.

18. The method of claim 17, further comprising optically sensing thicknesses of the substrate in at least two of the pressure zones and adjusting one or more of the respective pressures in response thereto.

19. The method of claim 17, further comprising computing from the one or more thicknesses at least one of:

a rate at which material is removed from the substrate;

an amount of material that has been removed from the substrate; and

a variation in thickness of the substrate.