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Transducer package with transducer die unsupported by a substrate

  • US 7,825,509 B1
  • Filed: 08/18/2009
  • Issued: 11/02/2010
  • Est. Priority Date: 06/13/2009
  • Status: Active Grant
First Claim
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1. A transducer package, comprising:

  • a MEMS transducer;

    a signal processing integrated circuit (IC), wherein said MEMS transducer is electrically connected to said signal processing IC;

    a plurality of terminal pads, wherein said plurality of terminal pads are unsupported by a substrate, and wherein said signal processing IC is electrically connected to said plurality of terminal pads;

    an encapsulation material, wherein at least a portion of an upper surface of each of said plurality of terminal pads is bonded to said encapsulation material, wherein a portion of said MEMS transducer is encapsulated by said encapsulation material, and wherein at least a portion of said signal processing IC is encapsulated by said encapsulation material; and

    a cover attached to a peripheral portion of one of said plurality of terminal pads.

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