Transducer package with transducer die unsupported by a substrate
First Claim
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1. A transducer package, comprising:
- a MEMS transducer;
a signal processing integrated circuit (IC), wherein said MEMS transducer is electrically connected to said signal processing IC;
a plurality of terminal pads, wherein said plurality of terminal pads are unsupported by a substrate, and wherein said signal processing IC is electrically connected to said plurality of terminal pads;
an encapsulation material, wherein at least a portion of an upper surface of each of said plurality of terminal pads is bonded to said encapsulation material, wherein a portion of said MEMS transducer is encapsulated by said encapsulation material, and wherein at least a portion of said signal processing IC is encapsulated by said encapsulation material; and
a cover attached to a peripheral portion of one of said plurality of terminal pads.
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Abstract
A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.
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Citations
29 Claims
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1. A transducer package, comprising:
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a MEMS transducer; a signal processing integrated circuit (IC), wherein said MEMS transducer is electrically connected to said signal processing IC; a plurality of terminal pads, wherein said plurality of terminal pads are unsupported by a substrate, and wherein said signal processing IC is electrically connected to said plurality of terminal pads; an encapsulation material, wherein at least a portion of an upper surface of each of said plurality of terminal pads is bonded to said encapsulation material, wherein a portion of said MEMS transducer is encapsulated by said encapsulation material, and wherein at least a portion of said signal processing IC is encapsulated by said encapsulation material; and a cover attached to a peripheral portion of one of said plurality of terminal pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification