Method and device for wafer scale packaging of optical devices using a scribe and break process

• US 7,825,519 B2
• Filed: 02/12/2008
• Issued: 11/02/2010
• Est. Priority Date: 12/08/2004
• Status: Expired due to Fees

• Current Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Original Assignee: Miradia Inc. (Walsin Lihwa Corporation)
• Inventors: Yang, Xiao, Chen, Dongmin, Chen, Philip
• Primary Examiner(s): LOUIE, WAI SING
• Application Number:
  US12/029,899
• Publication Number:
  US 20080191221A1
• Time in Patent Office: 994 Days
• Field of Search: 257/184, 257/257, 257/290, 257/680, 257/684, 257/777, 438/50, 438/52
• US Class Current: 257/777
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 33/483 Containers

Abstract

A multilayered integrated optical and circuit device. The device has a first substrate comprising at least one integrated circuit chip thereon, which has a cell region and a peripheral region. Preferably, the peripheral region has a bonding pad region, which has one or more bonding pads and an antistiction region surrounding each of the one or more bonding pads. The device has a second substrate with at least one or more deflection devices thereon coupled to the first substrate. At least one or more bonding pads are exposed on the first substrate. The device has a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member. The one or more bonding pads and the antistiction region are exposed while the one or more deflection devices is maintained within the portion of the cavity region.

Claims

1. A multilayered integrated optical and circuit device, the device comprising:

a first substrate comprising an integrated circuit chip thereon, the integrated circuit chip comprising a cell region and a peripheral region, the peripheral region comprising a bonding pad region, the bonding pad region comprising one or more bonding pads;

a second substrate comprising;

at least one or more deflection devices thereon coupled to the first substrate; and

an antistiction region surrounding each of the one or more bonding pads and exposing at least one bonding pad from the one or more bonding pads on the first substrate; and

a transparent member overlying the second substrate while forming a cavity region to allow the one or more deflection devices to move within a portion of the cavity region to form a sandwich structure including at least a portion of the first substrate, a portion of the second substrate, and a portion of the transparent member, wherein the one or more bonding pads and the antistiction region are disposed outside the cavity region while the one or more deflection devices are maintained within the portion of the cavity region.

2. The device of claim 1 wherein the transparent member comprises a transparent plate coupled to a frame structure, the frame structure forming a portion of the cavity region bounded by a portion of the transparent plate.

3. The device of claim 1 wherein the transparent member comprises a covalent bond to a portion of the second substrate.

4. The device of claim 1 wherein the antistiction region comprises a metal material.

5. The device of claim 1 wherein the transparent member comprises a portion bonded to a region surrounding the cell region.

6. The device of claim 1 wherein the transparent member comprises a substantially planar glass member coupled to a frame member.

7. The device of claim 6 wherein the substantially planar glass member is sealed to the frame member.