MEMS device having a recessed cavity and methods therefor

• US 7,826,127 B2
• Filed: 06/20/2007
• Issued: 11/02/2010
• Est. Priority Date: 06/21/2006
• Status: Expired due to Fees

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Chui, Clarence, Khonsari, Nassim
• Primary Examiner(s): Sugarman; Scott J
• Assistant Examiner(s): PINKNEY, DAWAYNE
• Application Number:
  US11/765,981
• Publication Number:
  US 20070297037A1
• Time in Patent Office: 1,231 Days
• Field of Search: 359/245, 359/247, 359/250, 359/254, 359/259, 359/337.22, 359/902, 359/302, 359/298, 359/316, 359/305, 359/308, 359/291, 257/678, 257/682, 438/115, 438/124, 398/149, 356/28.5, 356/35.5, 356/450, 356/460, 356/477, 342/156, 342/424, 342/94, 342/99
• US Class Current: 359/291
• CPC Class Codes: B81B 2201/047 Optical MEMS not provided for in B81B2201/042 - B81B2201/045
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/032 Gluing

Abstract

A microelectromechanical systems device having a transparent substrate joined to a planar backplate with a raised perimeter structure forming a recessed cavity or cell. The raised perimeter structure is formed by applying a first layer around the peripheral area of the backplate to form a recessed cell. A second layer is applied over the first layer. The first layer is thicker than the second layer. The thicker layer comprises a viscous material. A second layer is a thinner adhesive layer, and is applied over the thicker layer to join the backplate to the transparent substrate to encapsulate the microelectromechanical systems device formed on the transparent substrate.

Claims

1. A method of manufacturing a display device, comprising:

providing a transparent substrate having a microelectromechanical systems device formed thereon;

providing a substantially planar backplate;

applying a first layer around an outer peripheral area of the backplate to form a raised perimeter structure on the backplate;

applying an adhesive second layer over the first layer; and

joining the backplate to the transparent substrate by contacting the second layer to the transparent substrate to form a package after applying the adhesive second layer, wherein the microelectromechanical systems device is encapsulated by the package.

2. The method of claim 1, wherein the second layer is thinner than the first layer.

3. The method of claim 1, wherein the first layer comprises an organic or organic composite material.

4. The method of claim 3, wherein the organic or organic composite material is a viscous material.

5. The method of claim 3, wherein the organic or organic composite material is an epoxy-based adhesive.

6. The method of claim 3, wherein the organic or organic composite material comprises glass binding material selected from the group consisting of epoxy, polyurethane, polysulfide, silicone, vinyl acetate, cellulose vinyl, and neoprene.

7. The method of claim 1, wherein the first layer is dispensed along the outer peripheral area of the backplate.

8. The method of claim 1, wherein the first layer is screen printed along the outer peripheral area of the backplate.

9. The method of claim 1, wherein the first layer is formed by depositing a layer of photosensitive material over the backplate and patterning the layer of photosensitive material.

10. The method of claim 9, wherein the layer of photosensitive material is deposited by roller coating.

11. The method of claim 9, wherein the layer of photosensitive material is deposited by spin coating.

12. The method of claim 1, further comprising curing the first layer before applying the second layer.

13. The method of claim 1, wherein a combined thickness of the first layer and the second layer is in the range of about 20-60 microns.

14. The method of claim 1, further comprising applying a desiccant to the backplate before joining the backplate to the transparent substrate.

15. The method of claim 1, wherein the microelectromechanical systems device is an interferometric modulator.

16. A method of manufacturing a display device, comprising:

providing a substrate, the substrate supporting an array of interferometric modulators;

providing a backplate;

forming a raised perimeter structure on the backplate;

applying an adhesive layer over the raised perimeter structure after forming the raised perimeter structure on the backplate; and

sealing the backplate to the transparent substrate via the adhesive layer to form a package, wherein the array of interferometric modulators is encapsulated by the package.

17. The method of claim 16, wherein the raised perimeter structure comprises an organic or organic composite material.

18. The method of claim 17, wherein the organic or organic composite material is a viscous material.

19. The method of claim 17, wherein the organic or organic composite material is an epoxy-based adhesive.

20. The method of claim 17, wherein the organic or organic composite material comprises glass binding material selected from the group consisting of epoxy, polyurethane, polysulfide, silicone, vinyl acetate, cellulose vinyl, and neoprene.

21. The method of claim 16, further comprising curing the raised perimeter structure before applying the adhesive layer.

22. The method of claim 16, wherein a combined thickness of the first layer and the second layer is in the range of about 20-60 microns.

23. The method of claim 16, further comprising applying a desiccant to the backplate before joining the backplate to the transparent substrate.