Interconnect architecture for disc drive array
First Claim
Patent Images
1. A first storage device comprising:
- a housing;
an interface for connecting a second storage device on a first external side of the housing; and
a set of vias integrated with the housing, wherein the vias extend through the housing to connect the interface to a component located on a second external side, opposite the first external side, of the housing.
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Abstract
In general, the invention is directed to techniques for integrated interconnects with a set of disc drives. The interconnects allow for a set of disc drives to be positioned in an array; for example, as set of disc drives may be stacked to communicate with a device through a single interface of the device. The interconnects may be formed as vias within the housing of the disc drives. Vias may produced using MEMS techniques, e.g., electroplating, as part of the manufacturing processes of the disc drive itself.
28 Citations
21 Claims
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1. A first storage device comprising:
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a housing; an interface for connecting a second storage device on a first external side of the housing; and a set of vias integrated with the housing, wherein the vias extend through the housing to connect the interface to a component located on a second external side, opposite the first external side, of the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 20)
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9. An assembly comprising:
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an electronic device including a first interface; a first storage device connected to the electronic device via the first interface, wherein the first storage device includes; a housing including a set of vias integrated within the housing, wherein the vias extend through the housing, and a second interface; and a second storage device connected to the second interface, wherein communication signals between the second storage device and the electronic device traverse one or more via of the set of vias. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A storage device comprising:
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a housing fabricated using MEMS manufacturing processes; an interface for connecting an electronic device on a first external side of the housing; and a set of vias integrated with the housing, wherein the vias extend through the housing to connect the interface to a component located on a second external side, opposite the first external side, of the housing. - View Dependent Claims (18, 19, 21)
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Specification