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Composition for forming adhesive pattern, laminated structure obtained by using same, and method of producing such laminated structure

  • US 7,829,180 B2
  • Filed: 11/30/2007
  • Issued: 11/09/2010
  • Est. Priority Date: 05/31/2005
  • Status: Active Grant
First Claim
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1. A laminated structure, comprising:

  • component members and a cured resin product of an adhesive pattern formed on selected regions of the component members from the adhesive pattern-forming resin composition, wherein said resin composition is a photocurable and thermosetting adhesive comprising (A) a carboxyl group-containing photosensitive prepolymer having both a carboxyl group and an ethylenically unsaturated bond in its molecule and an acid value in the range of 30 to 160 mg KOH/g, (B) an epoxy resin, and (C) a photopolymerization initiator;

    wherein said component members are joined so as to be apart from each other through the medium of said cured resin product of the adhesive pattern as a structural support part.

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