LED chip package structure with high-efficiency light-emitting effect and method for making the same

• US 7,829,901 B2
• Filed: 09/29/2008
• Issued: 11/09/2010
• Est. Priority Date: 12/10/2007
• Status: Expired due to Fees

• Current Assignee: Harvatek Corporation
• Original Assignee: Harvatek Corporation
• Inventors: Wang, Bily, Wu, Wen-Kuei, Wu, Shih-Yu
• Primary Examiner(s): Mandala; Victor A
• Assistant Examiner(s): Moore; Whitney
• Application Number:
  US12/285,034
• Publication Number:
  US 20090146156A1
• Time in Patent Office: 771 Days
• Field of Search: 257/88, 257/91, 257/99, 257/100, 257/E33.001, 257/E21.001, 257/E25.02, 257/E33.05, 257/E33.07, 438/28, 438/26, 438/29
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/20 Light sources comprising attachment means
• CPC Class Codes: F21Y 2103/10 comprising a linear array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G02B 6/0031 Reflecting element, sheet or layer

Abstract

An LED chip package structure with high-efficiency light-emitting effect includes a substrate unit, a light-emitting unit, a package colloid unit, and a frame unit. The light-emitting unit has a plurality of LED chips electrically arranged on the substrate unit. The package colloid unit has a longitudinal package colloid covering the LED chips, and the longitudinal package colloid has a cambered colloid surface and a light-emitting colloid surface respectively formed on its top surface and a lateral surface thereof. The frame unit that is a frame layer covering the substrate unit and disposed around a lateral side of the longitudinal package colloid for exposing the light-emitting colloid surface of the longitudinal package colloid.

Claims

1. An LED chip package structure with high-efficiency light-emitting effect, comprising:

a substrate unit;

a light-emitting unit comprising a plurality of LED chips electrically arranged on the substrate unit;

a package colloid unit having a longitudinal package colloid for covering the LED chips, the longitudinal package colloid comprising a cambered colloid surface and a light-emitting colloid surface, wherein the colloid cambered surface is extended upwards and forwards over the substrate body and the light-emitting colloid surface is extended downwards from the colloid cambered surface toward the substrate unit; and

a frame unit formed over the substrate body for covering the package colloid unit and allowing light emission in the direction of the colloid light-emitting surface of the package colloid unit.

2. The LED chip package structure as claimed in claim 1, wherein the substrate unit is a PCB, a flexible substrate, an aluminum substrate, a ceramic substrate, or a copper substrate.

3. The LED chip package structure as claimed in claim 1, wherein the substrate unit has a positive electrode trace and a negative electrode trace both formed on the substrate body.

4. The LED chip package structure as claimed in claim 1, wherein the substrate body has a metal layer and a Bakelite layer formed on the metal layer.

5. The LED chip package structure as claimed in claim 3, wherein both the positive electrode trace and the negative electrode trace are aluminum circuits or silver circuits.

6. The LED chip package structure as claimed in claim 3, wherein each LED chip has a positive electrode side and a negative electrode side respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit.

7. The LED chip package structure as claimed in claim 6, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via two corresponding leading wires via a wire-bounding method.

8. The LED chip package structure as claimed in claim 6, wherein the positive electrode side and the negative electrode side of each LED chip are respectively and electrically connected with the positive electrode trace and the negative electrode trace of the substrate unit via a plurality of corresponding solder balls via a flip-chip method.

9. The LED chip package structure as claimed in claim 1, wherein the LED chips are straightly arranged on the substrate unit along a straight line.

10. The LED chip package structure as claimed in claim 1, wherein the LED chips are straightly arranged on the substrate unit along a plurality of straight lines.

11. The LED chip package structure as claimed in claim 1, wherein the longitudinal package colloid is a fluorescent resin that is formed by mixing silicon and fluorescent powders.

12. The LED chip package structure as claimed in claim 1, wherein the longitudinal package colloid is a fluorescent resin that is formed by mixing epoxy and fluorescent powders.

13. The LED chip package structure as claimed in claim 1, wherein the frame layer is an opaque frame layer.

14. The LED chip package structure as claimed in claim 13, wherein the opaque frame layer is a white frame layer.