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Quantum photonic imagers and methods of fabrication thereof

  • US 7,829,902 B2
  • Filed: 06/17/2009
  • Issued: 11/09/2010
  • Est. Priority Date: 09/27/2007
  • Status: Expired due to Fees
First Claim
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1. A digital semiconductor structure for bonding to a two-dimensional multicolor light emitting pixel array comprising:

  • multiple two dimensional arrays of pixel logic cells;

    a digital control logic region positioned at the periphery of the array of pixels logic cells;

    a plurality of device contact pads positioned at the periphery of the digital control logic region; and

    a plurality of metal layers configured to;

    interconnect the array of pixels logic cells with the digital control logic region;

    connect the digital control logic region with the plurality of the device contact pads; and

    interconnect the array of pixel logic cells with a two-dimensional multicolor light emitting pixel array.

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