MEMS microphone package and method thereof

• US 7,829,961 B2
• Filed: 11/21/2007
• Issued: 11/09/2010
• Est. Priority Date: 01/10/2007
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Hsiao, Wei-Min
• Primary Examiner(s): Smith; Bradley K
• Assistant Examiner(s): Valentine; Jami M
• Application Number:
  US11/943,599
• Publication Number:
  US 20080164545A1
• Time in Patent Office: 1,084 Days
• Field of Search: 257/416, 257/687, 257/E23.116, 438/127
• US Class Current: 257/416
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10158 : at the passive surface
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H04R 1/04 : Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 2201/003 : Mems transducers or their use

Abstract

A MEMS microphone package includes a carrier, an application specific IC, an encapsulant and a microphone chip. The application specific IC and the microphone chip are respectively disposed on first and second surfaces of the carrier, and the application specific IC and the microphone chip are electrically connected to the carrier. The encapsulant includes first and second encapsulants, the first encapsulant is formed on the first surface to seal the application specific IC, the second encapsulant is formed on the second surface to become a cavity and the microphone chip is located at the cavity. Because the application specific IC and the microphone chip are disposed on the first and second surfaces of the carrier, respectively, the second encapsulant surrounds the microphone chip, and the first and second encapsulants are formed at the same time, it can increase the structural strength of package and reduce the process.

Claims

1. A MEMS microphone package, comprising:

a carrier with a first surface and a second surface which is non-coplanar with and opposite to said first surface;

an application specific IC disposed on said first surface of said carrier and electrically connected to said carrier;

a first encapsulant formed on said first surface of said carrier to seal said application specific IC;

a second encapsulant formed on said second surface of said carrier to form a cavity together with said second surface of said carrier; and

a microphone chip disposed on said second surface of said carrier, in said cavity and electrically connected to said carrier.

2. The MEMS microphone package of claim 1, further comprising at least a first conductive element for electrically connecting said carrier and said application specific IC and at least a second conductive element for electrically connecting said carrier and said microphone chip.

3. The MEMS microphone package of claim 2, wherein said first conductive element and said second conductive element are selected from a group consisting of a bump and a wire.

4. The MEMS microphone package of claim 1, wherein said first encapsulant and said second encapsulant are formed in unity.

5. The MEMS microphone package of claim 1, wherein said carrier is selected from a group consisting of a substrate and a leadframe.

6. The MEMS microphone package of claim 1, further comprising a passive element disposed on said carrier.

7. The MEMS microphone package of claim 6, wherein said passive element is disposed on said first surface of said carrier and encapsulated by said first encapsulant.

8. The MEMS microphone package of claim 6, wherein said passive element is disposed on said second surface of said carrier and encapsulated by said second encapsulant.

9. The MEMS microphone package of claim 1, wherein said first encapsulant and said second encapsulant is selected from a group consisting of transfer molding compound, liquid molding compound and underfill.

10. The MEMS microphone package of claim 1, further comprising a cover having at least one hole and disposed on said second encapsulant.