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MEMS microphone package and method thereof

  • US 7,829,961 B2
  • Filed: 11/21/2007
  • Issued: 11/09/2010
  • Est. Priority Date: 01/10/2007
  • Status: Active Grant
First Claim
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1. A MEMS microphone package, comprising:

  • a carrier with a first surface and a second surface which is non-coplanar with and opposite to said first surface;

    an application specific IC disposed on said first surface of said carrier and electrically connected to said carrier;

    a first encapsulant formed on said first surface of said carrier to seal said application specific IC;

    a second encapsulant formed on said second surface of said carrier to form a cavity together with said second surface of said carrier; and

    a microphone chip disposed on said second surface of said carrier, in said cavity and electrically connected to said carrier.

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