Partitioned through-layer via and associated systems and methods
First Claim
1. A substrate, comprising:
- a non-conductive layer having a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section and a second section;
a partitioned via including a first metal interconnect within the via hole on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall, wherein the second metal interconnect is electrically isolated from the first metal interconnect;
first and second lead lands on the top side of the non-conductive layer, the first and second lead lands being electrically isolated from each other and being in direct contact with the first and second metal interconnects, respectively, the first and second lead lands at least partially surrounding the partitioned via; and
first and second traces on the top side of the non-conductive layer, the first and second traces being in electrical contact with and extending away from the first and second lead lands, respectively, wherein the first and second metal interconnects, the first and second lead lands, and the first and second traces are generally homogeneous and have the same thickness.
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Accused Products
Abstract
Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.
475 Citations
16 Claims
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1. A substrate, comprising:
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a non-conductive layer having a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section and a second section; a partitioned via including a first metal interconnect within the via hole on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall, wherein the second metal interconnect is electrically isolated from the first metal interconnect; first and second lead lands on the top side of the non-conductive layer, the first and second lead lands being electrically isolated from each other and being in direct contact with the first and second metal interconnects, respectively, the first and second lead lands at least partially surrounding the partitioned via; and first and second traces on the top side of the non-conductive layer, the first and second traces being in electrical contact with and extending away from the first and second lead lands, respectively, wherein the first and second metal interconnects, the first and second lead lands, and the first and second traces are generally homogeneous and have the same thickness. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A circuit board comprising a partitioned via having:
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a sidewall through a dielectric layer defining an opening; a first metal interconnect within the opening; and a second metal interconnect within the opening and electrically isolated from the first interconnect; first and second lead lands on a top side of the dielectric layer, the first and second lead lands being electrically isolated from each other and being in direct contact with the first and second metal interconnects, respectively, the first and second lead lands at least partially surrounding the opening; and first and second traces on the top side of the dielectric layer, the first and second traces being in direct contact with the first and second lead lands, respectively, wherein the first and second metal interconnects, the first and second lead lands, and the first and second traces are generally homogeneous and have the same thickness. - View Dependent Claims (10, 11, 12)
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13. An interconnect system, comprising:
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a circuit board layer having a surface and a via hole that extends through the circuit board layer; a first metal interconnect within the via hole; and a second metal interconnect within the via hole and electrically isolated from the first interconnect; a metal contact at the surface of the circuit board layer, wherein the metal contact at least partially surrounds the via hole, and the metal contact is electrically coupled to an opposing surface of the circuit board layer through the via hole and has a first portion electrically coupled to the first metal interconnect and a second portion electrically coupled to the second metal interconnect but electrically isolated from the first portion; a first metal trace attached to the circuit board layer and coupled to the first portion of the metal contact; and a second metal trace attached to the circuit board layer and coupled to the second portion of the metal contact, wherein the first and second interconnects, the first and second portions of the metal contact, and the first and second traces are generally homogeneous and have the same thickness. - View Dependent Claims (14, 15, 16)
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Specification