System and method for compensating for radiation induced thermal distortions in a substrate or projection system

• US 7,830,493 B2
• Filed: 10/25/2005
• Issued: 11/09/2010
• Est. Priority Date: 10/04/2005
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Maria Zaal, Koen Jacobus Johannes, Tinnemans, Patricius Aloysius Jacobus, Venema, Willem Jurrianus
• Primary Examiner(s): Kim; Peter B
• Assistant Examiner(s): LIU, MICHAEL
• Application Number:
  US11/257,399
• Publication Number:
  US 20070076180A1
• Time in Patent Office: 1,841 Days
• Field of Search: 355/30, 355/53, 355 72- 74
• US Class Current: 355/30
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70875 Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
• CPC Class Codes: G03F 7/70891 Temperature

Abstract

A system and method are used to compensate for thermal effect on a lithographic apparatus. The system comprises a patterning device, a projection system, a substrate position controller, and a substrate-position-based expansion-compensator. The patterning device modulates a radiation beam. The projection system projects the modulated radiation beam onto a target portion of a substrate. The substrate position controller moves the substrate relative to the projection system sequentially through a plurality of exposure positions. The substrate-position-based expansion-compensator interacts with the substrate position controller to modify the exposure positions in order at least partially to compensate for thermally-induced geometrical changes of at least one of the substrate and projection system.

Claims

1. A lithographic apparatus, comprising:

a modulation system configured to emit a modulated radiation beam;

a projection system configured to project the modulated radiation beam onto a target portion of a substrate;

a substrate position controller configured to move the substrate relative to the projection system;

a temperature measurement system configured to measure a temperature of the projection system;

a substrate-position-based expansion-compensator coupled to the substrate position controller and together configured to modify a position of the substrate relative to the projection system based on measurements from the temperature measurement system; and

a conversion system configured to convert a first representation of a desired dose pattern into a control signal configured to control the modulation system, the conversion system comprising a control-signal-based expansion-compensator configured to adapt the control signal to at least partially compensate for thermal expansion of the projection system and the substrate by generating a compensated dose pattern produced by the modulation system.

2. The lithographic apparatus of claim 1, wherein the substrate-position-based expansion-compensator modifies the position of the substrate based on an effect on the projection system caused by the temperature.

3. The lithographic apparatus of claim 1, wherein:

the substrate position controller moves the substrate in a direction substantially parallel to a first axis; and

the substrate-position-based expansion-compensator modifies an exposure position in a direction parallel to the first axis.