Power converter

• US 7,830,689 B2
• Filed: 11/01/2007
• Issued: 11/09/2010
• Est. Priority Date: 11/02/2006
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi, Ltd.
• Inventors: Saito, Ryuichi, Nakatsu, Kinya, Funato, Hiroki, Suga, Takashi, Nakamura, Takayoshi
• Primary Examiner(s): BERHANE, ADOLF D
• Application Number:
  US11/933,690
• Publication Number:
  US 20080130223A1
• Time in Patent Office: 1,104 Days
• Field of Search: 363/141, 363/144, 361/689, 361/699, 361/704, 361/715
• US Class Current: 363/141
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.

Claims

1. A power converter comprising:

a housing,

a coolant path structure installed in said housing for forming a coolant path for letting a coolant pass,

a capacitor arranged on one side of said coolant path structure in said housing, having a DC terminal,

a power semiconductor circuit arranged on the other side of said coolant path structure in said housing, having a DC terminal, an AC terminal, and a power semiconductor chip for converting a direct current supplied from said DC terminal to an alternating current by an operation of said power semiconductor chip and outputting it from said AC terminal, and

a first connecting wire for connecting electrically said DC terminal of said capacitor arranged on one side of said coolant path structure to said DC terminal of said power semiconductor circuit arranged on the other side of said coolant path structure by penetrating a hole formed in said coolant path structure, wherein;

DC power supplied to said housing is supplied to said DC terminal of said capacitor and to said DC terminal of said power semiconductor circuit, and is converted to AC power by said operation of said semiconductor chip, and said AC power is outputted from said AC terminal of said power semiconductor circuit.

2. The power converter according to claim 1, wherein:

said power semiconductor circuit has a semiconductor module including externally said DC terminal and said AC terminal and including internally said power semiconductor chip and

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor module.

3. The power converter according to claim 2, wherein:

said semiconductor module includes a metal base and a resin case fixed to said metal base,

said power semiconductor chip is fixed to said metal base via an insulation board in said resin case,

said DC terminal and said AC terminal arranged outside said resin case, and

said metal base of said semiconductor module is fixed to said coolant path structure.

4. The power converter according to claim 3, wherein:

said coolant path structure forms at least two parallel coolant paths,

said power semiconductor circuit has at least two semiconductor modules,

said at least two semiconductor modules are arranged respectively in correspondence with two cooling paths and said at least two semiconductor modules are fixed to said coolant path structure so that said DC terminals of said at least two semiconductor modules approach each other, and

said first connecting wire penetrating said coolant path structure is arranged between said two parallel coolant paths.

5. A power converter comprising:

a metal housing,

a coolant inlet installed in said metal housing,

a coolant outlet installed in said metal housing,

a coolant path structure for forming a coolant path for leading a coolant flowing in from said coolant inlet to said coolant outlet in said housing, fixed mechanically to said metal housing,

a capacitor arranged on one side of said coolant path structure in said housing, having a DC terminal,

a power semiconductor circuit arranged on the other side of said coolant path structure in said housing, having a DC terminal, an AC terminal, and a power semiconductor chip for converting a direct current supplied from said DC terminal to an alternating current by an operation of said power semiconductor chip and outputting it from said AC terminal, and

a first connecting wire for connecting electrically said DC terminal of said capacitor arranged on one side of said coolant path structure to said DC terminal of said power semiconductor circuit arranged on the other side of said coolant path structure by penetrating a hole formed through said coolant path structure, wherein;

said first connecting wire forms a laminating structure holding an insulator therebetween and

DC power supplied to said housing is supplied to said DC terminal of said capacitor and to said DC terminal of said power semiconductor circuit, and is converted to AC power by said operation of said semiconductor chip, and said AC power is outputted from said AC terminal of said power semiconductor circuit.

6. The power converter according to claim 5, wherein:

said power semiconductor circuit has an almost rectangular semiconductor module including externally said DC terminal and said AC terminal and including internally said power semiconductor chip,

said semiconductor module is fixed to said coolant path structure so that long sides of said rectangular semiconductor module coincide with a flow direction of a coolant flowing in said coolant path,

said hole is formed at a part of said coolant path structure positioned on a side of said coolant path, and

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor module via said hole formed in said coolant path structure.

7. The power converter according to claim 6, wherein:

said semiconductor module includes an almost rectangular metal base and an almost rectangular resin case fixed to said metal base,

said power semiconductor chip is fixed to said metal base via an insulation board in said resin case,

said DC terminal is arranged on one long side of said almost rectangular resin case,

said AC terminal is arranged on the other long side of said almost rectangular resin case, and

so that long sides of said metal base of said semiconductor module coincide with said flow direction of said coolant in said coolant path and moreover said DC terminal of the said semiconductor module is arranged on the side of said hole formed in said coolant path structure, said metal base is fixed to said coolant path structure.

8. The power converter according to claim 7, wherein:

an AC power terminal for supplying AC power to a motor is mounted on said metal housing and

said AC terminal of said semiconductor module and said AC power terminal are connected electrically with a second bar connecting wire.

9. The power converter according to claim 8, wherein:

said coolant path structure forms at least two parallel coolant paths,

said power semiconductor circuit has at least two semiconductor modules,

said at least two semiconductor modules are arranged respectively in correspondence with two cooling paths and said at least two semiconductor modules are fixed to said coolant path structure so that said DC terminals of said at least two semiconductor modules are put into an arrangement relationship of approaching each other, and

said hole permitting said first connecting wire to penetrate is installed in said coolant path structure positioned between said two parallel coolant paths and outside said two parallel coolant paths, said second connecting wire is arranged.

10. A power converter comprising:

a housing,

a coolant path structure installed in said housing for forming a coolant path for letting a coolant pass,

a capacitor arranged on one side of said coolant path structure in said housing, having a DC terminal,

a power semiconductor circuit arranged on the other side of said coolant path structure in said housing, having a metal base, a resin case fixed to said metal base, a DC terminal and an AC terminal arranged outside said resin case, a power semiconductor chip fixed to one surface of said metal base via an insulation board in said resin case, and cooling fins fixed to the other surface of said metal base for converting a direct current supplied from said DC terminal to an alternating current by an operation of said power semiconductor chip and outputting it from said AC terminal, and

a first connecting wire penetrating said coolant path structure for connecting electrically said DC terminal of said capacitor arranged on one side of said coolant path structure to said DC terminal of said power semiconductor circuit arranged on the other side of said coolant path structure, wherein;

said coolant path formed by said coolant path structure has an opening,

said cooling fins of said power semiconductor circuit are projected into said coolant path from said opening of said coolant path and said power semiconductor circuit is fixed to said coolant path structure so as to seal said opening of said coolant path by said metal base of said power semiconductor circuit,

a hole is formed at a part of said coolant path structure positioned on a side of said opening of said coolant path,

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor circuit via said hole, and

DC power supplied to said housing is supplied to said DC terminal of said capacitor and to said DC terminal of said power semiconductor circuit, and is converted to AC power by said operation of said semiconductor chip and said AC power is outputted from said AC terminal of said power semiconductor circuit.

11. The power converter according to claim 10, wherein:

said metal base of said power semiconductor circuit is almost rectangular,

said DC terminal is arranged outside said resin case positioned on one long side of said almost rectangular metal base,

said AC terminal is arranged outside said resin case positioned on the other long side of said almost rectangular metal base,

said opening of said coolant path is long and narrow in the flowing direction of said coolant, and

so that long sides of said metal base of said semiconductor circuit coincide with a flow direction of said coolant, said metal base of said power semiconductor circuit is fixed to said coolant path structure.

12. The power converter according to claim 11, wherein:

said coolant path structure forms at least two parallel coolant paths,

almost rectangular openings long in the flowing direction are formed respectively in said coolant paths,

said power semiconductor circuit has at least two sets of metal bases including said resin case, said DC terminal and said AC terminal arranged on said resin case, said power semiconductor chip fixed to one surface via an insulation board, and said cooling fins fixed to the other surface,

said metal bases have a plurality of holes for fixing by screws around them,

said metal bases seal said openings of said coolant paths and so that said cooling fins held by said metal bases are projected from said openings into the coolant paths and furthermore said DC terminals held by said metal bases approach each other, are fixed to said coolant path structure by screws,

a hole is formed at a part of said coolant path structure positioned between said two parallel coolant paths, and

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor circuit via said hole.

13. A power converter comprising:

a metal housing,

a coolant inlet installed in said metal housing,

a coolant outlet installed in said metal housing,

a coolant path structure for leading a coolant flowing in from said coolant inlet to said coolant outlet in said housing, fixed mechanically to said metal housing for forming a coolant path,

a capacitor arranged on one side of said coolant path structure in said housing, having a DC terminal,

a power semiconductor circuit arranged on the other side of said coolant path structure in said housing, having a DC terminal, an AC terminal, and a power semiconductor chip for converting a direct current supplied from said DC terminal to an alternating current by an operation of said power semiconductor chip and outputting it from said AC terminal, and

a first connecting wire penetrating said coolant path structure for connecting electrically said DC terminal of said capacitor arranged on one side of said coolant path structure to said DC terminal of said power semiconductor circuit arranged on the other side of said coolant path structure, wherein;

said coolant path has an opening,

said power semiconductor circuit has cooling fins,

said power semiconductor circuit is arranged so that said cooling fins are projected internally into said opening of said coolant path,

DC power supplied to said housing is supplied to said DC terminal of said capacitor and said DC terminal of said power semiconductor circuit, and said supplied DC power is converted to AC power by said operation of said semiconductor chip, and said AC power is outputted from said AC terminal of said power semiconductor circuit,

said power semiconductor circuit has an almost rectangular semiconductor module including externally said DC terminal and said AC terminal and including internally said power semiconductor chip,

said semiconductor module is fixed to said coolant path structure so that long sides of said rectangular semiconductor module coincide with a flow direction of a coolant in said coolant path,

a hole is formed at a part of said coolant path structure positioned on a side of said opening of said coolant path, and

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor module via said hole formed in said coolant path structure.

14. The power converter according to claim 13, wherein:

said semiconductor module includes an almost rectangular metal base and a resin case fixed to one surface of said metal base,

said power semiconductor chip is fixed to one surface of said metal base via an insulation board in said resin case,

said DC terminal is arranged at a part of said resin case positioned on one almost rectangular long side of said metal base,

said AC terminal is arranged at a part of said resin case positioned on the other almost rectangular long side of said metal base,

said cooling fins are fixed to the other surface of said metal base,

said opening of said coolant path has an almost rectangular shape long in said flowing direction of said coolant, and

said cooling fins of said semiconductor module are projected into said opening and said opening is sealed by said metal base of said semiconductor module.

15. The power converter according to claim 14, wherein:

an AC power terminal for supplying AC power to a motor is mounted on said metal housing and

said AC terminal of said semiconductor module and said AC power terminal are connected electrically with a second bar connecting wire.

16. The power converter according to claim 15, wherein:

said coolant path structure forms at least two parallel coolant paths,

said opening is formed in each of said coolant paths,

said power semiconductor circuit has at least two sets of said semiconductor modules,

each of said semiconductor modules is fixed to said coolant path structure so that said cooling fins of each of said semiconductor modules is projected internally from each of said openings, and

said hole permitting said first connecting wire to penetrate is installed in said coolant path structure positioned between said two parallel coolant paths.

17. The power converter according to claim 16, wherein:

said two semiconductor modules are fixed so that said DC terminals of said at least two semiconductor modules are arranged inside said two parallel coolant paths and

said second connecting wire is arranged outside said two parallel coolant paths.

18. A power converter comprising:

a metal housing,

an engine coolant inlet installed in said metal housing,

an engine coolant outlet installed in said metal housing,

a coolant path structure for forming a coolant path for leading an engine coolant flowing in from said coolant inlet to said coolant outlet in said housing, fixed mechanically to said metal housing,

a capacitor arranged on one side of said coolant path structure in said housing, having a DC terminal,

a power semiconductor circuit arranged on the other side of said coolant path structure in said housing, having a DC terminal, an AC terminal, and a power semiconductor chip for converting a direct current supplied from said DC terminal to an alternating current by an operation of said power semiconductor chip and outputting it from said AC terminal, and

a first connecting wire penetrating said coolant path structure for connecting electrically said DC terminal of said capacitor arranged on one side of said coolant path structure to said DC terminal of said power semiconductor circuit arranged on the other side of said coolant path structure, wherein;

said coolant path has an opening,

said power semiconductor circuit has cooling fins,

said power semiconductor circuit is arranged so that said cooling fins are projected internally into said opening of said coolant path,

DC power supplied to said housing is supplied to said DC terminal of said capacitor and said DC terminal of said power semiconductor circuit, and said supplied DC power is converted to AC power by said operation of said semiconductor chip, and said AC power is outputted from said AC terminal of said power semiconductor circuit,

said power semiconductor circuit has an almost rectangular semiconductor module including externally said DC terminal and said AC terminal and including internally said power semiconductor chip,

said semiconductor module is fixed to said coolant path structure so that long sides of said rectangular semiconductor module coincide with a flow direction of an engine coolant flowing in said coolant path,

a first hole is formed at a part of said coolant path structure positioned on a side of said opening of said coolant path, and

said first connecting wire penetrating said coolant path structure connects electrically said DC terminal of said capacitor and said DC terminal of said semiconductor module via said first hole formed in said coolant path structure.

19. The power converter according to claim 18, wherein:

said semiconductor module includes an almost rectangular metal base and a resin case fixed to one surface of said metal base,

said power semiconductor chip is fixed to one surface of said metal base via an insulation board in said resin case,

said DC terminal is arranged at a part of said resin case positioned on one almost rectangular long side of said metal base,

said AC terminal is arranged at a part of said resin case positioned on the other almost rectangular long side of said metal base,

said cooling fins are fixed to the other surface of said metal base,

said opening of said coolant path has an almost rectangular shape long in said flowing direction of said engine coolant, and

said cooling fins of said semiconductor module are projected into said opening and said opening is sealed by said metal base of said semiconductor module.

20. The power converter according to claim 19, wherein:

an AC power terminal for supplying AC power to a motor is mounted on said metal housing,

said AC terminal of said semiconductor module and said AC power terminal are connected electrically with a second bar connecting wire, and

a second hole is formed at a part of said coolant path structure positioned on the opposite side to said first hole formed in said coolant path structure for said opening of said coolant path and said second connecting wire is arranged so as to penetrate said second hole.

21. The power converter according to claim 20, wherein:

said coolant path structure forms at least two parallel coolant paths,

said opening is formed in each of said coolant paths,

said power semiconductor circuit has at least two sets of said semiconductor modules,

each of said semiconductor modules is fixed to said coolant path structure so that said cooling fins of each of said semiconductor modules is projected internally from each of said openings,

said first hole permitting said first connecting wire to penetrate is installed in said coolant path structure positioned between said two parallel coolant paths, and

said second holes permitting said second connecting wire to penetrate are installed respectively in said coolant path structures positioned outside said two parallel coolant paths.