Multi-chip package
First Claim
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1. A semiconductor device, comprising:
- a leadframe comprising a first side and a second side, wherein the second side comprises a first landing pad for a surface mount component;
a first integrated circuit die bonded to the first side of the leadframe; and
a package to encapsulate at least a portion of the first integrated circuit and at least a portion of the leadframe, wherein at least a portion of the first landing pad is not encapsulated by the package.
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Abstract
Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in tire pressure monitoring systems.
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Citations
29 Claims
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1. A semiconductor device, comprising:
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a leadframe comprising a first side and a second side, wherein the second side comprises a first landing pad for a surface mount component; a first integrated circuit die bonded to the first side of the leadframe; and a package to encapsulate at least a portion of the first integrated circuit and at least a portion of the leadframe, wherein at least a portion of the first landing pad is not encapsulated by the package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method, comprising:
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forming a first landing pad for a surface mount component on a first side of a leadframe; bonding a first integrated circuit die to a second side of the leadframe; and encapsulating with a first material at least a portion of the first integrated circuit die and at least a portion of the leadframe leaving the first landing pad substantially not encapsulated. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A semiconductor device, comprising:
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means for providing electrical connections comprising a first side and a second side, wherein said second side comprises a first landing pad for a surface mount component; a first integrated circuit die bonded to the first side of the means for providing electrical connections; and means for encapsulating at least a portion of the first integrated circuit die and at least a portion of the means for providing electrical connections, wherein at least a portion of the first landing pad is not encapsulated. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification