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Optoelectronic subassembly with integral thermoelectric cooler driver

  • US 7,832,944 B2
  • Filed: 05/27/2008
  • Issued: 11/16/2010
  • Est. Priority Date: 11/08/2007
  • Status: Active Grant
First Claim
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1. An optical subassembly comprising:

  • a housing;

    a substrate mounted within the housing;

    a first thermoelectric cooler (TEC) thermally coupled to the substrate, the first TEC being mounted within the housing;

    a second TEC disposed in the optical subassembly, wherein the second TEC is disposed atop, and in direct contact with, the first TEC;

    an optical component structurally mounted on the substrate, wherein the optical component is thermally coupled to the first TEC; and

    a TEC driver electrically coupled to the first and second TECs, wherein the TEC driver is configured to electrically drive the first and second TECs, the TEC driver being mounted within the housing.

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