Methods for fabricating semiconductor components and packaged semiconductor components
First Claim
1. A method of manufacturing semiconductor components, comprising:
- forming a plurality of first trenches in lanes between dies on a first side of a semiconductor wafer;
filling at least a portion of the first trenches with a protective material;
forming a plurality of second trenches on a second side of the wafer before cutting through the wafer, wherein the first trenches are at least generally aligned with the second trenches along the lanes;
filling at least a portion of the second trenches with the protective material before cutting through the wafer; and
cutting through the wafer along the lanes after forming the plurality of second trenches and after filling at least a portion of the second trenches.
8 Assignments
0 Petitions
Accused Products
Abstract
Packaged semiconductor components and methods for manufacturing packaged semiconductor components. In one embodiment a semiconductor component comprises a die having a semiconductor substrate and an integrated circuit. The substrate has a first side, a second side, a sidewall between the first and second sides, a first indentation at the sidewall around a periphery of the first side, and a second indentation at the sidewall around a periphery of the second side. The component can further include a first exterior cover at the first side and a second exterior cover at the second side. The first exterior cover has a first extension in the first indentation, and the second exterior cover has a second extension in the second indentation. The first and second extensions are spaced apart from each other by an exposed portion of the sidewall.
30 Citations
24 Claims
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1. A method of manufacturing semiconductor components, comprising:
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forming a plurality of first trenches in lanes between dies on a first side of a semiconductor wafer; filling at least a portion of the first trenches with a protective material; forming a plurality of second trenches on a second side of the wafer before cutting through the wafer, wherein the first trenches are at least generally aligned with the second trenches along the lanes; filling at least a portion of the second trenches with the protective material before cutting through the wafer; and cutting through the wafer along the lanes after forming the plurality of second trenches and after filling at least a portion of the second trenches. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 20, 21, 22)
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10. A method for manufacturing semiconductor components, comprising:
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depositing a first protective material on a first side of a semiconductor wafer having a plurality of dies, wherein the first protective material flows into first trenches in lanes between the dies on the first side of the wafer; depositing a second protective material on a second side of the wafer before separating the wafer along the lanes, the second protective material being different than the first material, wherein the second protective material flows into second trenches in the second side of the wafer that are aligned with the first trenches in the lanes; and separating the wafer along the lanes after depositing a second protective material on the second side of the wafer. - View Dependent Claims (11, 12, 13, 14, 15, 23, 24)
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16. A method of manufacturing semiconductor components, comprising:
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mounting conductive balls to die contacts connected to integrated circuits of dies on a semiconductor wafer, wherein the die contacts are at a first side of the wafer; cutting first trenches into the first side of the wafer along lanes adjacent to the dies, wherein the first trenches have a first depth into the wafer; molding a polymeric material onto the first side and into the first trenches; thinning the wafer to a second side opposite the first side; cutting second trenches into the second side of the wafer after the thinning procedure, wherein the second trenches are aligned with the first trenches along the lanes, and wherein the second trenches have a second depth into the wafer, such that the second trenches do not extend into the first trenches; molding the polymeric material onto the second side and into the second trenches; and cutting the wafer along the lanes and through the polymeric material in the second trenches, wherein cutting the wafer forms individual components that have a first exterior cover at the first side with a first extension extending toward the second side, a second exterior cover at the second side with a second extension extending toward the first side, and a sidewall between the first and second sides, wherein the sidewall includes an exterior portion of the first extension, an exterior portion of the second extension, and an exposed portion of the semiconductor wafer between the first and second extensions. - View Dependent Claims (17, 18, 19)
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Specification