Aluminum cap for reducing scratch and wire-bond bridging of bond pads
First Claim
1. A method of manufacturing a semiconductor device, the method comprising:
- providing a workpiece, the workpiece having at least one conductive pad with an overlying passivation layer;
forming an opening in the passivation layer, thereby at least partially exposing the at least one conductive pad, the passivation layer having a top surface and the opening in the passivation layer having sidewalls;
forming a barrier layer over the at least one conductive pad, wherein the barrier layer lines the sidewalls of the opening in the passivation layer and is disposed over a top portion of the passivation layer proximate the opening such that the barrier layer has a top surface over the top surface of the passivation layer;
forming a conductive cap over the barrier layer within the opening in the passivation layer, the conductive cap completely filling the opening; and
recessing the conductive cap to a height below the top surface of the passivation layer and the top surface of the barrier layer.
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Accused Products
Abstract
A method of manufacturing a semiconductor device and structure thereof. The method includes providing a workpiece, the workpiece having at least one conductive pad partially exposed through an opening in a passivation layer, the passivation layer having a top surface and the opening in the passivation layer having sidewalls. A barrier layer is formed over the at least one conductive pad, wherein the barrier layer lines the sidewalls of the opening in the passivation layer and is disposed over a top portion of the passivation layer proximate the opening. A conductive cap is formed over the barrier layer within the opening in the passivation layer, and the conductive cap is recessed to a height below the top surface of the passivation layer. The conductive cap may be used for testing with a probe or may be used for wire-bonding.
47 Citations
14 Claims
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1. A method of manufacturing a semiconductor device, the method comprising:
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providing a workpiece, the workpiece having at least one conductive pad with an overlying passivation layer; forming an opening in the passivation layer, thereby at least partially exposing the at least one conductive pad, the passivation layer having a top surface and the opening in the passivation layer having sidewalls; forming a barrier layer over the at least one conductive pad, wherein the barrier layer lines the sidewalls of the opening in the passivation layer and is disposed over a top portion of the passivation layer proximate the opening such that the barrier layer has a top surface over the top surface of the passivation layer; forming a conductive cap over the barrier layer within the opening in the passivation layer, the conductive cap completely filling the opening; and recessing the conductive cap to a height below the top surface of the passivation layer and the top surface of the barrier layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification