Semiconductor device and programming method
First Claim
1. A method for fabricating a semiconductor device comprising:
- mounting a semiconductor chip on a chip mounting portion;
disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion, wherein disposing the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
7 Assignments
0 Petitions
Accused Products
Abstract
The present invention include a semiconductor device and a method therefore, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefore, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
-
Citations
18 Claims
-
1. A method for fabricating a semiconductor device comprising:
-
mounting a semiconductor chip on a chip mounting portion; disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion, wherein disposing the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (2)
-
-
3. The method as claimed in clam 1, wherein forming the resin sealing portion is forming the resin sealing portion by transfer molding.
-
4. The method as claimed in clam 1, wherein the sheet-shaped resin does not include a filler.
-
5. The method as claimed in clam 1, wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
-
6. The method as claimed in clam 1, wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.
-
7. The method as claimed in clam 1, wherein the semiconductor chip has stacked semiconductor chips.
-
8. The method as claimed in clam 1, further comprising:
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
-
9. The method as claimed in clam 1 further comprising:
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.
-
10. A system comprising:
-
means for mounting a semiconductor chip on a chip mounting portion; means for disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion, wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (11)
-
-
12. The method as claimed in clam 10, wherein the resin sealing portion is formed by transfer molding.
-
13. The method as claimed in clam 10, wherein the sheet-shaped resin does not include a filler.
-
14. The method as claimed in clam 10, wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
-
15. The method as claimed in clam 10, wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.
-
16. The method as claimed in clam 10, wherein the semiconductor chip has stacked semiconductor chips.
-
17. A method for fabricating a semiconductor device comprising:
-
mounting a semiconductor chip on an upper die portion; disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is opposite to the semiconductor chip, wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip; and assembling the upper die portion and the lower die portion; and sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip. - View Dependent Claims (18)
-
Specification