Multilayer electronic component systems and methods of manufacture

• US 7,834,808 B2
• Filed: 11/23/2005
• Issued: 11/16/2010
• Est. Priority Date: 06/29/2005
• Status: Active Grant

• Current Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Original Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Inventors: Bairavasubramanian, Ramanan, Li, RongLin, DeJean, Gerald, Wang, Guoan, Tentzeris, Emmanouil M., Thompson, Dane, Kingsley, Nickolas D., Papapolymerou, Ioannis
• Primary Examiner(s): Le; HoangAnh T
• Application Number:
  US11/993,890
• Publication Number:
  US 20100090902A1
• Time in Patent Office: 1,819 Days
• Field of Search: 343/700.MS, 343/853, 296/00
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 21/24 Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001
• CPC Class Codes: H01Q 5/42 using two or more imbricated arrays H01Q5/49 takes precedence
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 2201/0141 Liquid crystal polymer [LCP]
• CPC Class Codes: H05K 2203/065 Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB
• CPC Class Codes: H05K 3/4626 characterised by the insulating layers or materials H05K3/4688 takes precedence
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Claims

1. A multilayer electronic component system comprising:

a first layer of liquid crystal polymer (LCP) exhibiting a first melting temperature;

first electronic components supported by the first layer; and

a second layer of LCP exhibiting a second melting temperature lower than the first melting temperature;

wherein the first layer is attached to the second layer by thermal bonds associated with melted material of the second layer of LCP contacting solid material of the first layer of LCP; and

wherein at least a portion of the first electronic components are located between the first layer and the second layer.

2. The system of claim 1, further comprising a third layer of LCP located such that the second layer is positioned between the first layer and the third layer, the second layer being thermally bonded to the first layer and the third layer.

3. The system of claim 2, further comprising second electronic components supported by the third layer.

4. The system of claim 3, wherein the first electronic components comprise a first antenna array and the second electronic components comprise a second antenna array.

5. The system of claim 4, wherein the first antenna array and the second antenna array operate at different frequencies and the system further exhibits dual polarization.

6. The system of claim 4, wherein polarization directions of each of the first antenna array and the second antenna is 45°

and 135°

.

7. The system of claim 4, wherein each of the first antenna array and the second antenna array operates at GHz frequencies.

8. The system of claim 7, wherein the first antenna array operates at approximately 14 GHz and the second antenna array operates at approximately 35 GHz.

9. The system of claim 4, further comprising means for shifting a phase of a signal of the first antenna array.

10. The system of claim 4, further comprising a phase shifter electrically interconnected with the first antenna array and operative to shift a phase of a signal of the first antenna array.

11. The system of claim 10, wherein the phase shifter comprises a microelectromechanical system (MEMS) switch.

12. The system of claim 2, wherein the first layer and the third layer exhibit higher melting temperatures than a melting temperature of the second layer.

13. The system of claim 12, wherein the first layer, the second layer and the third layer exhibit substantially similar coefficients of thermal expansion such that mechanical stresses between the layers are reduced.

14. A multilayer electronic component system comprising:

a first layer of liquid crystal polymer (LCP);

a first antenna array supported by the first layer;

a second layer of LCP fixed with respect to the first layer;

a second antenna array supported by the second layer; and

a third layer of LCP located and thermally bonded between the first layer and the second layer by melted material of the third layer, the first layer and the second layer exhibiting higher melting temperatures than a melting temperature of the third layer;

wherein the first antenna array and the second antenna array operate at different GHz frequencies.

15. The system of claim 14, wherein the first antenna array has polarization directions of 45°

and 135°

.

16. The system of claim 15, wherein the first antenna array has a symmetrical feed network with respect to each of the polarization directions.

17. A method for manufacturing a multilayer electronic component system comprising:

providing a first layer of liquid crystal polymer (LCP) exhibiting a first melting temperature;

supporting first electronic components with the first layer;

providing a second layer of LCP exhibiting a second melting temperature lower than the first melting temperature;

exposing the first layer and the second layer to a temperature at least as high as the second melting temperature but below the first melting temperature to melt at least a portion of the second layer; and

using melted material of the second layer to thermally bond the second layer of LCP to the first layer such that the first electronic components are located between at least a portion of the first layer and at least a portion of the second layer.

18. The method of claim 17, wherein the method further comprises:

providing a third layer of LCP; and

orienting the third layer such that the second layer is positioned between the first layer and the third layer; and

wherein the exposing further comprises exposing the first layer, the second layer and the third layer to a temperature at least as high as the second melting temperature but below the first melting temperature to melt at least a portion of the second layer such that melted material of the second layer thermally bonds the third layer bonds to the second layer.

19. The method of claim 18, wherein a melting temperature of the second layer is lower than melting temperatures of the first layer and the third layer.