Method and system of temperature-control for electronic component

• US 7,836,717 B2
• Filed: 12/11/2006
• Issued: 11/23/2010
• Est. Priority Date: 06/09/2006
• Status: Active Grant

• Current Assignee: Gigabyte Technology Company Limited (Giga-Byte Technology Co.)
• Original Assignee: Gigabyte Technology Company Limited (Giga-Byte Technology Co.)
• Inventors: Kao, Ting-Kuo, Liao, Tse-Hsine
• Primary Examiner(s): JIANG, CHEN WEN
• Application Number:
  US11/609,239
• Publication Number:
  US 20070296408A1
• Time in Patent Office: 1,443 Days
• Field of Search: 622/592, 236/49.3, 236/94, 236/1.C, 165/104.33, 165/80.4, 361/699, 361/690, 361/698, 361/688, 361/697
• US Class Current: 62/259.2
• CPC Class Codes: G05D 23/1931 to control the temperature of one space
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A method and a system of temperature-control for an electronic component are provided, in which a plurality of temperature sensors is disposed in each area of the electronic component. The temperature-control method includes obtaining a plurality of sensed temperature values; looking up a temperature-control table recording the relationship between a temperature-control threshold and a temperature-control operation set for each area; selecting the temperature-control operation corresponding to sensed temperature values greater than the temperature-control thresholds depending on the temperature-control table; and starting the temperature-control operation to make the sensed temperature values being lower than or equal to the temperature-control thresholds.

Claims

1. A method of temperature-control for an electronic component, wherein a plurality of temperature sensors is disposed in each area of an electronic component, the method comprising:

obtaining a plurality of sensed temperature values of each area;

starting a first-stage temperature-control operation when one of the sensed temperature values of each area is greater than a temperature-control threshold;

starting a second-stage temperature-control operation when the sensed temperature values of adjacent areas are different; and

starting a third-stage temperature-control operation when one of the sensed temperature values in each area is greater than the temperature-control threshold, so as to make the sensed temperature values being lower than or equal to the temperature-control threshold.

2. The method of temperature-control for an electronic component according to claim 1, wherein the first-stage temperature-control operation is one selected from a group consisting of a first fan control, a second fan control, a third fan control, and a fourth fan control.

3. The method of temperature-control for an electronic component according to claim 1, wherein the second-stage temperature-control operation is an output current balance control of a power supply.

4. The method of temperature-control for an electronic component according to claim 1, wherein the third-stage temperature-control operation is an operating performance control of a CPU.

5. The method of temperature-control for an electronic component according to claim 1, wherein the method is integrated into a computer program.

6. The method of temperature-control for an electronic component according to claim 5, wherein the computer program is stored in a computer hard disk.

7. The method of temperature-control for an electronic component according to claim 5, wherein the user interface of the computer program is an icon selection interface.

8. A system of temperature-control for an electronic component, comprising:

a plurality of temperature sensors disposed in each area of an electronic component of a computer mainboard for obtaining the sensed temperature values of the electronic component;

a temperature analysis module for analyzing the sensed temperature values and then generating an analysis result;

a first temperature-control processing module for starting a first-stage temperature-control operation when the analysis result shows that one of the sensed temperature values of each area is greater than a temperature-control threshold;

a second temperature-control processing module for starting a second-stage temperature-control operation when the sensed temperature values of adjacent areas are different; and

a third temperature-control processing module for starting a third-stage temperature-control operation when the analysis result shows that one of the sensed temperature values of each area is still greater than the temperature-control threshold.

9. The system of temperature-control for an electronic component as claimed in claim 8, wherein the first-stage temperature-control operation is one selected from a group consisting of a first fan control, a second fan control, a third fan control, and a fourth fan control.

10. The system of temperature-control for an electronic component as claimed in claim 8, wherein the second-stage temperature-control operation is an output current balance control of a power supply.

11. The system of temperature-control for an electronic component as claimed in claim 8, wherein the third-stage temperature-control operation is an operating performance control of a CPU.