Substrate supporting structure for semiconductor processing, and plasma processing device

• US 7,837,828 B2
• Filed: 09/09/2005
• Issued: 11/23/2010
• Est. Priority Date: 03/12/2003
• Status: Expired due to Fees

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Yamamoto, Kaoru, Ikeda, Taro, Tanaka, Sumi
• Primary Examiner(s): Kackar; Ram N.
• Application Number:
  US11/221,704
• Publication Number:
  US 20060005930A1
• Time in Patent Office: 1,901 Days
• Field of Search: 118/724, 118/725, 156/345.53, 361/234, 279/128
• US Class Current: 156/345.53
• CPC Class Codes: H01J 2237/2001 Maintaining constant desired temperature
• CPC Class Codes: H01J 37/32431 Constructional details of the reactor
• CPC Class Codes: H01L 21/67109 mainly by convection
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

A substrate supportingstructure (50) for semiconductor processing, comprising a mounting table (51) for placing a processed substrate (W) disposed in a processing chamber (20), wherein temperature control spaces (507) for storing the fluid used as a heat exchange medium are formed in the mounting table (51), a conductive transmission path (502) is disposed to lead a high frequency power to the mounting table (51), and flow channels (505, 506) feeding or discharging the heat exchange medium fluid to or from the temperature control spaces (507) are formed in the transmission path (502).

Claims

1. A substrate supporting structure for semiconductor processing comprising:

a mounting table for mounting thereon a substrate to be processed;

a support part, disposed to be downwardly extended below the mounting table, for supporting the mounting table;

an electrostatic chuck, disposed on the mounting table, for electrostatically adsorbing the substrate to the mounting table; and

a wiring for supplying a DC voltage to the electrostatic chuck,

wherein the mounting table includes an electrode part;

a first insulating layer for covering a periphery of the electrode part;

a second insulating layer for covering a bottom surface of the electrode part; and

a first conducting layer covering the entire first and second insulating layers,

wherein the support part includes a conductive transmission path for supplying a power to the electrode part;

a third insulating layer for covering a periphery of the transmission path; and

a second conducting layer for covering a periphery of the third insulating layer,

wherein the electrode part of the mounting table, the first and the second insulating layers and the first conducting layer are coaxially configured;

the conductive transmission path of the support part, the third insulating layer and the second conducting layer are coaxially configured;

the electrode part and the conductive transmission path are integrally formed; and

the first and the second conducting layers are electrically connected to each other,

wherein a first channel for supplying a heat exchange medium into the electrode part is formed; and

a second channel communicated with the first channel is formed in the conductive transmission path,

wherein, in the mounting table and the support part, a first sealing member is disposed between the electrode part and the second insulating layer and a second sealing member is disposed between the second insulating layer and the first conducting layer in order to airtightly separate a mounting table side and a support part side,

wherein each of the first and the second insulating layer is made of quartz, and the third insulating layer is made of a resin,

wherein the second channel is formed in a thermally insulating tube installed in the conductive transmission path,

wherein the conductive transmission path comprises said wiring to supply the DC voltage to the electrostatic chuck,

wherein the wiring has an enlarged diameter head portion of a substantially multi stepped cone shape at a part in contact with the electrostatic chuck, the head portion having a bottom portion of a relatively larger diameter and a top portion which reduces in diameter towards an electrode layer of the electrostatic chuck, and being coated with a thermal spraying insulating film, and

wherein the conductive transmission path is provided with an insertion hole to introduce the wiring therethrough, and the insertion hole is filled with insulation layers to insulate the introduced wiring,

Where the head portion and the wiring are secured by conforming the insulation layers around the wiring part in the insertion hole.

2. The substrate supporting structure of claim 1, further comprising a gas flow passage, formed in the transmission path, for supplying a heat transfer gas between the mounting table and the substrate.

3. The substrate supporting structure of claim 1, wherein each of the first and the second insulating layer is made of a low dielectric quartz.

4. The substrate supporting structure of claim 1, wherein the third insulating layer is made of a low dielectric resin.

5. The substrate supporting structure of claim 1, wherein the power supplied to the electrode part is a high frequency power.

6. The substrate supporting structure of claim 1, wherein the electrostatic chuck is configured such that an electrode layer is embedded between an upper and a lower insulating layer;

and the electrode layer and the insulating layers of the electrostatic chuck are integrally formed to have an uneven surface structure such that a groove is formed on a surface of the electrostatic chuck; and

a gas flow passage, formed in the transmission path for supplying a heat transfer gas between the mounting table and the substrate, is connected to the groove.

7. The substrate supporting structure of claim 1, wherein the head portion is of an overlapped shape of plural sub-portions having different diameters.

8. The substrate supporting structure of claim 1, wherein the insertion hole is provided with a ring, and the wiring is attached to a hole formed in the ring.

9. A plasma processing device, comprising:

an airtight processing chamber for accommodating therein a substrate to be processed;

a gas supply unit for supplying a processing gas into the processing chamber;

a gas pumping unit for exhausting the processing chamber;

a mounting table, disposed in the processing chamber, for mounting thereon the substrate;

a support part, disposed to be downwardly extended below the mounting table, for supporting the mounting table;

an electrostatic chuck, disposed on the mounting table, for electrostatically adsorbing the substrate to the mounting table; and

a wiring for supplying a DC voltage to the electrostatic chuck,

wherein the mounting table includes an electrode part;

a first insulating layer for covering a periphery of the electrode part;

a second insulating layer for covering a bottom surface of the electrode part; and

a first conducting layer covering the entire first and second insulating layers,

wherein the support part includes a conductive transmission path for supplying a power to the electrode part;

a third insulating layer for covering a periphery of the transmission path; and

a second conducting layer for covering a periphery of the third insulating layer,

wherein the electrode part of the mounting table, the first and the second insulating layers and the first conducting layer are coaxially configured;

the conductive transmission path of the support part, the third insulating layer and the second conducting layer are coaxially configured;

the electrode part and the conductive transmission path are integrally formed; and

the first and the second conducting layers are electrically connected to each other,

wherein a first channel for supplying a heat exchange medium into the electrode part is formed, and a second channel communicated with the first channel is formed in the conductive transmission path,

wherein, in the mounting table and the support part, a first sealing member is disposed between the electrode part and the second insulating layer and a second sealing member is disposed between the second insulating layer and the first conducting layer in order to airtightly separate a mounting table side and a support part side, and

wherein each of the first and the second insulating layer is made of quartz, and the third insulating layer is made of a resin,

wherein the second channel is formed in a thermally insulating tube installed in the conductive transmission path,

wherein the conductive transmission path comprises said wiring to supply the DC voltage to the electrostatic chuck,

wherein the wiring has an enlarged diameter head portion of a substantially multi stepped cone shape at a part in contact with the electrostatic chuck, the head portion having a bottom portion of a relatively larger diameter and a top portion which reduces in diameter towards an electrode layer of the electrostatic chuck, and being coated with a thermal spraying insulating film, and

wherein the conductive transmission path is provided with an insertion hole to introduce the wiring therethrough, and the insertion hole is filled with insulation layers to insulate the introduced wiring,

where the head portion and the wiring are secured by conforming the insulation layers around the wiring part in the insertion hole.

10. The plasma processing device of claim 9, wherein an exhaust chamber having smaller outline than the processing chamber is connected to the support part to surround same below the processing chamber, and wherein the exhaust chamber exhausts the processing chamber through a space between the exhaust chamber and the support part.

11. The plasma processing device of claim 9, wherein the second conducting layer is grounded.

12. The plasma processing device of claim 9, wherein the second channel is connected to a circulation unit for circulating the heat exchanged medium.

13. The plasma processing device of claim 9, further comprising a gas flow passage, formed in the transmission path, for supplying a heat transfer gas between the mounting table and the substrate.

14. The plasma processing device of claim 9, wherein the power supplied to the electrode part is a high frequency power.

15. The plasma processing device of claim 9, wherein the insertion hole is provided with a ring, and the wiring is attached to a hole formed in the ring.