Pixel well electrode

• US 7,838,313 B2
• Filed: 07/31/2007
• Issued: 11/23/2010
• Est. Priority Date: 07/31/2007
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Arthur, Alan R., Hellekson, Ronald A.
• Primary Examiner(s): Smith; Zandra
• Assistant Examiner(s): NIESZ, JAMIE C
• Application Number:
  US11/831,586
• Publication Number:
  US 20090032816A1
• Time in Patent Office: 1,211 Days
• Field of Search: 438/29, 438/30, 438/34, 349/191
• US Class Current: 438/30
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/13439 characterised by their electrical, optical, physical properties; materials therefor; method of making
• CPC Class Codes: G02F 1/136295 Materials; Compositions; Manufacture processes

Abstract

Various apparatus and methods relating to pixel wells and electrodes that are at least partially concurrently formed are disclosed.

Claims

1. A method comprising:

providing a dielectric substrate;

concurrently forming or forming features for locating pixel wells and electrodes associated with each pixel well on opposite sides of the substrate.

2. The method of claim 1 further comprising:

concurrently embossing opposite sides of a panel including the dielectric substrate sandwiched between blankets of conductive material and opposite layers of embossable material to form the pixel wells on opposite sides of the substrate; and

selectively removing portions of the blankets of the conductive material and the layers of embossable material to form a first electrode and a second electrode along a floor of each pixel well, wherein portions of each blanket form portions of pixel wells sidewalls, the first electrode and the second electrode.

3. The method of claim 2 further comprising:

removing portions of the blanket to form a grid including first conductor line associated with the first electrode and a second line associated with the second electrode, wherein portions of the second conductor line are removed at an intersection of the first conductor line and the second conductor line;

electrophoretically depositing a dielectric material or a dielectric capable material that is subsequently made dielectric to form a dielectric layer on the first conductor line at the junction; and

electrophoretically depositing a conductive material on portions of the blanket and over the dielectric layer to form a grid crossover.

4. The method of claim 3, wherein the dielectric capable material comprises a PEDOT:

PSS polymer mixture (Poly(3,4 ethylenedioxythiopene) poly(styrensulfonate) and wherein the PEDOT is subsequently made dielectric through oxidation, or wherein the dielectric material is a UV curable dielectric material.

5. The method of claim 2, wherein the embossable material comprises a UV curable resin.

6. The method of claim 2, wherein the embossing is with opposing multi-level embossing stamps that are x-y feature aligned.

7. The method of claim 2, wherein the dielectric substrate is a transparent polymer.

8. The method of claim 1, wherein the dielectric substrate is a transparent polymer.

9. The method of claim 1 further comprising an electric field or charge to a charge responsive optical material in the pixel wells.

10. A method comprising:

embossing a first side of a panel including a dielectric substrate supporting a first blanket of conductive material sandwiched between the dielectric substrate and a first embossable layer to form first pixel wells; and

selectively removing portions of the first blanket of conductive material and portions of the first layer of embossable material to form first and second pixel electrodes along a floor of each first pixel well, wherein portions of the first blanket form first pixel well sidewalls and the first and second pixel electrodes,

and wherein the first and second first pixel electrodes form a foundation under a centerline of the first pixel well sidewalls.

11. The method of claim 10, wherein the panel includes a second blanket of conductive material sandwiched between the dielectric substrate and a second embossable layer and wherein the method further comprises:

embossing the second side of the panel to form second pixel wells; and

selectively removing portions of the second blanket of conductive material and portions of the second layer of embossable material to form first and second second pixel electrodes along a floor of each second pixel well, wherein portions of the second blanket form second pixel well sidewalls and the first and second second pixel electrodes.

12. The method of claim 11, wherein the first side and the second side of the panel are concurrently embossed.