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Integrated circuit package system with image sensor system

  • US 7,838,899 B2
  • Filed: 11/20/2009
  • Issued: 11/23/2010
  • Est. Priority Date: 01/04/2006
  • Status: Active Grant
First Claim
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1. An integrated circuit package system comprising:

  • an integrated circuit die including an image sensor system having interconnects connected thereto; and

    a transparent encapsulant on the integrated circuit die with portions of the interconnects exposed and with only the transparent encapsulant over the image sensor system to comprise an image sensor device;

    a substrate having passive or active devices electrically connected thereto and having an aperture provided therein;

    the image sensor device mounted face up or face down at least partially in the aperture with the interconnects connected to the substrate by bonding wires or electrical connections; and

    an encapsulant encapsulating the bonding wires.

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