Integrated circuit package system with image sensor system

• US 7,838,899 B2
• Filed: 11/20/2009
• Issued: 11/23/2010
• Est. Priority Date: 01/04/2006
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Kuan, Heap Hoe, Chow, Seng Guan
• Primary Examiner(s): Parekh; Nitin
• Application Number:
  US12/623,351
• Publication Number:
  US 20100065936A1
• Time in Patent Office: 368 Days
• Field of Search: 257/100, 257/98, 257/787, 257/784, 257/E21.502, 257/433, 257/E31.105
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01067 Holmium [Ho]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/10156 at the periphery
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

Claims

1. An integrated circuit package system comprising:

an integrated circuit die including an image sensor system having interconnects connected thereto; and

a transparent encapsulant on the integrated circuit die with portions of the interconnects exposed and with only the transparent encapsulant over the image sensor system to comprise an image sensor device;

a substrate having passive or active devices electrically connected thereto and having an aperture provided therein;

the image sensor device mounted face up or face down at least partially in the aperture with the interconnects connected to the substrate by bonding wires or electrical connections; and

an encapsulant encapsulating the bonding wires.

2. The system as claimed in claim 1 wherein the image sensor device is mounted on the substrate with the interconnects connected to the substrate.

3. The system as claimed in claim 1 wherein

the substrate having the aperture provided therein and board substrate connectors on the bottom thereof;

and

the image sensor device mounted on the substrate at least partially in the aperture and among the substrate connectors with the interconnects connected to the substrate.

4. The system as claimed in claim 1 further comprising:

a dam around the periphery of the substrate,

the image sensor device mounted on the substrate with the interconnects connected to the substrate; and

a liquid encapsulant material around the image sensor device and filling the dam.

5. An integrated circuit package system comprising:

an integrated circuit die including image sensor systems having interconnects connected thereto; and

a transparent encapsulant encapsulating the image sensor systems with a notch to expose portions of the interconnects and with only the transparent encapsulant over the image sensor systems to comprise an image sensor device;

a substrate having passive or active devices electrically connected thereto and having an aperture provided therein;

the image sensor device mounted face up or face down at least partially in the aperture with the interconnects connected to the substrate by bonding wires or electrical connections; and

an encapsulant encapsulating the bonding wires.

6. The system as claimed in claim 5 wherein the image sensor device is mounted face up on the substrate.

7. The system as claimed in claim 5 further comprising substrate connectors on the bottom of the aperture, the image sensor device mounted face up at least partially in the aperture and among the substrate connectors.

8. The system as claimed in claim 5 further comprising:

a dam around the periphery of the substrate; and

a solidified liquid encapsulant material in the dam to cover the bonding wires.