Heat spreader for memory modules
First Claim
1. A heat spreader configured to be placed in thermal communication with a memory module having at least a first side, the heat spreader comprising:
- a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit mounted on the first side; and
a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.
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Accused Products
Abstract
A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.
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Citations
19 Claims
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1. A heat spreader configured to be placed in thermal communication with a memory module having at least a first side, the heat spreader comprising:
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a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit mounted on the first side; and a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A heat spreader configured to be placed in thermal communication with a memory module having a first side with a first plurality of integrated circuits thereon and a second side with a second plurality of integrated circuits thereon, the heat spreader comprising:
a heat spreader segment mountable on the memory module to be in thermal communication with at least one integrated circuit of the first plurality of integrated circuits on the first side, to be substantially thermally isolated from at least one integrated circuit of the first plurality of integrated circuits the first side, and to be in thermal communication with at least one integrated circuit of the second plurality of integrated circuits on the second side, wherein the heat spreader segment extends over a portion of the memory module between the first side and the second side.
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13. A heat spreader configured to be placed in thermal communication with a memory module having at least a first side, the heat spreader comprising:
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a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side and to be substantially thermally isolated from at least one integrated circuit on the first side; a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment, wherein at least one of the first segment and the second segment comprises a metal sheet, wherein at least one of the first segment and the second segment comprises; a first portion positionable to be in thermal communication with at least one integrated circuit of either the plurality of integrated circuits that are in thermal communication with the first segment or the at least one integrated circuit that is substantially thermally isolated from the first segment; and a second portion comprising a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow to cool the heat spreader. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification