Heat spreader for memory modules

• US 7,839,643 B1
• Filed: 11/12/2009
• Issued: 11/23/2010
• Est. Priority Date: 02/17/2006
• Status: Active Grant

• Current Assignee: Netlist, Inc.
• Original Assignee: Netlist, Inc.
• Inventors: Yu, Enchao
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US12/617,665
• Time in Patent Office: 376 Days
• Field of Search: 361/704, 361709-711, 361/715, 361/719, 165 802- 803, 165/185, 174/16.1, 174/16.3, 257/713, 257/718, 257/719, 257/E23.101, 257/E23.105
• US Class Current: 361/715
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat spreader is provided for use with a memory module. The memory module has at least a first side with a first plurality of integrated circuits thereon. The heat spreader includes a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit on the first side. The heat spreader further includes a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

Claims

1. A heat spreader configured to be placed in thermal communication with a memory module having at least a first side, the heat spreader comprising:

a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side, and to be substantially thermally isolated from at least one integrated circuit mounted on the first side; and

a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment.

2. The heat spreader of claim 1, wherein the plurality of integrated circuits comprises a first plurality of dynamic random-access memory (DRAM) devices and the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment comprises an advanced memory buffer.

3. The heat spreader of claim 2, wherein the memory module further comprises a second side, a second plurality of dynamic random-access memory (DRAM) devices on the second side, and a thermally conductive material positionable between and in thermal communication with the second segment and at least one DRAM device on the second side.

4. The heat spreader of claim 2, wherein the first segment comprises a hole which substantially thermally isolates the first segment from the advanced memory buffer.

5. The heat spreader of claim 2, further comprising a thermally conductive material positionable between and in thermal communication with the first segment and the first plurality of DRAM devices.

6. The heat spreader of claim 1, wherein at least one of the first segment and the second segment comprises a single unitary element.

7. The heat spreader of claim 1, wherein the first segment comprises a first portion positionable to be in thermal communication with the plurality of integrated circuits on the first side and a second portion which extends generally away from the first portion.

8. The heat spreader of claim 7, wherein the second portion comprises one or more generally planar portions.

9. The heat spreader of claim 7, wherein the second portion comprises a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow to cool the module.

10. The heat spreader of claim 7, wherein the second segment is substantially thermally isolated from the first segment.

11. The heat spreader of claim 1, further comprising a fastener configured to be mechanically coupled to the first segment and the second segment.

12. A heat spreader configured to be placed in thermal communication with a memory module having a first side with a first plurality of integrated circuits thereon and a second side with a second plurality of integrated circuits thereon, the heat spreader comprising:

a heat spreader segment mountable on the memory module to be in thermal communication with at least one integrated circuit of the first plurality of integrated circuits on the first side, to be substantially thermally isolated from at least one integrated circuit of the first plurality of integrated circuits the first side, and to be in thermal communication with at least one integrated circuit of the second plurality of integrated circuits on the second side, wherein the heat spreader segment extends over a portion of the memory module between the first side and the second side.

13. A heat spreader configured to be placed in thermal communication with a memory module having at least a first side, the heat spreader comprising:

a first segment mountable on the memory module to be in thermal communication with a plurality of integrated circuits on the first side and to be substantially thermally isolated from at least one integrated circuit on the first side;

a second segment mountable on the memory module to be in thermal communication with the at least one integrated circuit on the first side that is substantially thermally isolated from the first segment,

wherein at least one of the first segment and the second segment comprises a metal sheet, wherein at least one of the first segment and the second segment comprises;

a first portion positionable to be in thermal communication with at least one integrated circuit of either the plurality of integrated circuits that are in thermal communication with the first segment or the at least one integrated circuit that is substantially thermally isolated from the first segment; and

a second portion comprising a surface extending generally parallel to the first portion, wherein the first portion and the second portion generally define a region therebetween through which air can flow to cool the heat spreader.

14. The heat spreader of claim 13, wherein the first portion is substantially flat.

15. The heat spreader of claim 13, wherein the first portion is contoured.

16. The heat spreader of claim 13, wherein the second portion comprises one or more generally planar surfaces.

17. The heat spreader of claim 13, wherein the second portion comprises one or more angled or curved surfaces.

18. The heat spreader of claim 13, wherein the metal sheet is cut, bent, or both cut and bent.

19. The heat spreader of claim 13, wherein the region comprises a channel having a “

C”

-shaped cross-section.