Abrasive articles, CMP monitoring system and method

• US 7,840,305 B2
• Filed: 06/28/2006
• Issued: 11/23/2010
• Est. Priority Date: 06/28/2006
• Status: Active Grant

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Pendergrass, Daniel B. Jr., Behr, Andrew H., Laraia, Vincent J., Goers, Brian D., Palmgren, Gary M.
• Primary Examiner(s): Shechtman; Sean P
• Application Number:
  US11/427,154
• Publication Number:
  US 20080004743A1
• Time in Patent Office: 1,609 Days
• Field of Search: 700108-110, 700/121, 700/164, 700/169, 700/171, 700173-176, 700/179, 451/1, 451/5, 451/6, 451/7, 451/443, 451/444, 451/446, 438/5, 438/7, 438/16, 702/81, 702/84
• US Class Current: 700/174
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 49/02 according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent B24B49/12 takes precedence
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24B 49/14 taking regard of the temperature during grinding
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The disclosure relates to abrasive articles useful in chemical-mechanical polishing (CMP), the articles including a substrate with opposite major surfaces, an abrasive material overlaying at least a portion of at least one of the major surfaces, and at least one of a radio frequency identification (RFID) tag, a RFID tag reader, or a sensor for providing CMP information to a transmitter positioned near the substrate, the transmitter positioned near the substrate and adapted to wirelessly receive CMP information and wirelessly transmit the CMP information to a remote receiver. The disclosure also relates to a CMP pad conditioner for wirelessly communicating CMP information to a remote receiver, a CMP process monitoring system for wirelessly communicating CMP information to a remote receiver, and a method for conditioning a CMP pad using a CMP process monitoring system for wireless communicating CMP information to a remote receiver.

Claims

1. An abrasive article, comprising:

a substrate having opposite major surfaces;

an abrasive material overlaying at least a portion of at least one of the major surfaces of the substrate to form a surface of an abrasive article, wherein said abrasive material comprises abrasive particles embedded in a matrix material comprising a metal and affixed to the substrate by the matrix material;

a sensor for providing chemical-mechanical polishing (CMP) information positioned within the substrate; and

a transmitter in wireless communication with the sensor and positioned within the substrate proximate the sensor, wherein the transmitter is adapted to wirelessly transmit the CMP information provided by the sensor to a receiver remote from the abrasive article.

2. The abrasive article of claim 1, further comprising a RFID tag.

3. The abrasive article of claim 1, wherein the sensor is selected from one or more of the group consisting of a thickness sensor, a velocity sensor, an acceleration sensor, a vibration sensor, a force sensor, a pressure sensor, a temperature sensor, a pH sensor, a chemical composition sensor, and a chemical concentration sensor.

4. The abrasive article of claim 3, wherein the sensor is an eddy current thickness sensor adapted to measure a CMP pad thickness.

5. The abrasive article of claim 1, wherein the transmitter is a component in a transponder for a RFID system, and wherein the remote receiver is a reader for the RFID system.

6. The abrasive article of claim 5, wherein one or both of the transponder and the reader further comprises one or more of the group consisting of a demodulator circuit, a resonator circuit, a transmitter, a receiver, a processor, a controller, a memory, an analog to digital converter, a digital to analog converter, an antenna, and a power source.

7. The abrasive article of claim 1, wherein the CMP information is selected from one or more of CMP pad conditioner data, CMP pad data, and measured CMP process data including one or more of a velocity, acceleration, force, pressure, vibration, thickness, temperature, pH, chemical composition, and chemical concentration measured in a CMP process.

8. The abrasive article of claim 7, wherein at least one of the CMP pad conditioner data and the CMP pad data is selected from the group consisting of manufacturing data, composition data, tracking data, quality data, and history data.

9. The abrasive article of claim 1, further comprising a mounting port provided in at least one of the major surfaces.

10. The abrasive article of claim 9, wherein the mounting port includes an orifice extending between both major surfaces.

11. The abrasive article of claim 9, further comprising a bearing proximate the mounting port, wherein the bearing is adapted to permit rotation of a pad conditioner about the transmitter.

12. A chemical-mechanical polishing (CMP) process monitoring system, comprising:

at least one abrasive article including a substrate having opposite major surfaces and an abrasive material overlaying at least a portion of at least one of the major surfaces, wherein said abrasive material comprises abrasive particles embedded in a matrix material comprising a metal and affixed to the substrate by the matrix material;

at least one sensor positioned within the substrate proximate the at least one major surface, wherein each sensor is adapted to determine CMP information;

a transmitter in wireless communication with the sensor and positioned within the substrate in wireless communication range of the sensor, wherein the transmitter is adapted to wirelessly transmit at least a portion of the CMP information; and

at least one receiver remote from the abrasive article and adapted to receive the wirelessly transmitted CMP information.

13. The system of claim 12, wherein the CMP information is selected from at least one of CMP pad conditioner data, CMP pad data, and measured CMP process data.

14. The system of claim 13, wherein at least one of the CMP pad conditioner data and the CMP pad data are selected from the group consisting of manufacturing data, composition data, tracking data, quality data, and history data.

15. The system of claim 12, further comprising a controller adapted to process the CMP information and provide a control response selected from the group consisting of altering a CMP pad characteristic, altering a CMP pad conditioner characteristic, altering a CMP polishing slurry characteristic, and altering a CMP process characteristic.

16. The system of claim 12, wherein the sensor, the transmitter, and the receiver comprise a radio frequency identification system.

17. The system of claim 16, wherein the radio frequency identification system further comprises at least one of a RFID tag, a modulator circuit, a demodulator circuit, a resonator circuit, an analog to digital converter, a digital to analog converter, a memory, a controller, an antenna, and a power source.

18. The system of claim 12, wherein each sensor is selected from the group consisting of a thickness sensor, a velocity sensor, an acceleration sensor, a vibration sensor, a force sensor, a pressure sensor, a temperature sensor, a pH sensor, a chemical composition sensor, a chemical concentration sensor, and a RFID tag reader.