Light emitting packages and methods of making same
First Claim
1. A lighting package comprising:
- at least one light emitting chip;
a board supporting the at least one light emitting chip;
a light-transmissive encapsulant disposed over the at least one light emitting chip and over a footprint area of the board;
a light-transmissive generally conformal shell disposed over the light-transmissive encapsulant and having an inner surface spaced apart by an air gap from and generally conformal with an outer surface of the light-transmissive encapsulant; and
a phosphor disposed on or embedded in the conformal shell and configured to output converted light responsive to irradiation by the at least one light emitting chip;
wherein the light-transmissive encapsulant and conformal shell are generally hemispherical and the footprint area of the board is generally circular with a radius about equal to a radius of the hemispherical light-transmissive encapsulant and the air gap between the outer surface of the light-transmissive encapsulant and the inner surface of the conformal shell is at least about 0.5 millimeter.
8 Assignments
0 Petitions
Accused Products
Abstract
In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).
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Citations
12 Claims
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1. A lighting package comprising:
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at least one light emitting chip; a board supporting the at least one light emitting chip; a light-transmissive encapsulant disposed over the at least one light emitting chip and over a footprint area of the board; a light-transmissive generally conformal shell disposed over the light-transmissive encapsulant and having an inner surface spaced apart by an air gap from and generally conformal with an outer surface of the light-transmissive encapsulant; and a phosphor disposed on or embedded in the conformal shell and configured to output converted light responsive to irradiation by the at least one light emitting chip; wherein the light-transmissive encapsulant and conformal shell are generally hemispherical and the footprint area of the board is generally circular with a radius about equal to a radius of the hemispherical light-transmissive encapsulant and the air gap between the outer surface of the light-transmissive encapsulant and the inner surface of the conformal shell is at least about 0.5 millimeter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A lighting package comprising:
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one or more light emitting chips; a board supporting the one or more light emitting chips; a light-transmissive encapsulant disposed over the one or more light emitting chips and over a footprint area of the board; and a remote phosphor disposed in a phosphor layer located remote from the one or more light emitting chips and proximate to an outer surface of the light-transmissive encapsulant, the remote phosphor configured to output converted light responsive to irradiation by the one or more light emitting chips; wherein a heat-sinking component in contact with substantially the whole phosphor layer comprises a material having a thermal conductivity that is higher than 0.3 W/(m·
K). - View Dependent Claims (10, 11, 12)
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Specification