Encapsulant interposer system with integrated passive devices and manufacturing method therefor

• US 7,843,047 B2
• Filed: 11/21/2008
• Issued: 11/30/2010
• Est. Priority Date: 11/21/2008
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Lte.
• Original Assignee: Stats Chippac BVI limited (JCET Group Co., Ltd.)
• Inventors: Kuan, Heap Hoe, Chow, Seng Guan, Huang, Rui, Lin, Yaojian
• Primary Examiner(s): Picardat; Kevin M
• Assistant Examiner(s): Au; Bac H
• Application Number:
  US12/276,297
• Publication Number:
  US 20100127361A1
• Time in Patent Office: 739 Days
• Field of Search: 257/667, 257/670, 257/672, 257/676, 257/686, 257690-693, 257723-724, 257/735, 257/773, 257/778
• US Class Current: 257/676
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/0557 the external layer being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/1023 : the support being an insulating substrate
• CPC Class Codes: H01L 2225/1041 : Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
• CPC Class Codes: H01L 2225/1058 : Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1088 : Arrangements to limit the height of the assembly
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/495 : Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49506 : an insulative substrate being used as a diepad, e.g. ceramic, plastic H01L23/49531 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 : the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/03 : all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A method of manufacturing a semiconductor package system including: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.

Claims

1. A semiconductor package system comprising:

an encapsulant interposer having a passive device encapsulated with both the top and the bottom surfaces of the passive device exposed;

a first die connected to the encapsulant interposer; and

a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer.

2. The system as claimed in claim 1 wherein the encapsulant interposer having a passive device encapsulated has a connect bar bent to a predetermined shape.

3. The system as claimed in claim 1 further comprising:

a package mold compound encapsulating the encapsulant interposer, the first die, and the second die.

4. The system as claimed in claim 3 wherein the first die is electrically connected to the substrate interposer through a bonding wire.

5. The system as claimed in claim 3 wherein the package mold compound has a package mold compound opening, exposing the top surface of the encapsulant interposer.

6. The system as claimed in claim 3 wherein the first die is a first type flip chip die.

7. The system as claimed in claim 3 wherein the first die is a second type flip chip die.