Tuning improvements in “inverted-L” planar antennas

• US 7,843,397 B2
• Filed: 07/16/2004
• Issued: 11/30/2010
• Est. Priority Date: 07/24/2003
• Status: Active Grant

• Current Assignee: Qualcomm Technologies Incorporated (Qualcomm, Inc.)
• Original Assignee: Epcos AG (TDK Corporation)
• Inventors: Boyle, Kevin R.
• Primary Examiner(s): Owens; Douglas W
• Assistant Examiner(s): DUONG, DIEU HIEN
• Application Number:
  US10/565,928
• Publication Number:
  US 20080055174A1
• Time in Patent Office: 2,328 Days
• Field of Search: 343/700.MS, 343/702, 343/745
• US Class Current: 343/745
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 9/0421 with a shorting wall or a shorting pin at one end of the element H01Q9/0414 takes precedence

Abstract

A communications apparatus, includes a housing (40) containing a printed circuit board (PCB) (12) having a ground plane (16) and electronic components in rf shields (18) thereon. A planar antenna (10) is mounted spaced from the ground plane and a dielectric (14) is present in a space between the PCB and the planar antenna. A feed (36) couples the planar antenna (10) to the rf components.

Claims

1. A planar antenna assembly for use in two different frequency bands, the planar antenna assembly comprising:

a printed circuit board having a ground plane and RF circuitry thereon;

a patch antenna spaced from the ground plane, the patch antenna not having any slot;

a feed for coupling the patch antenna to the RF circuitry, the feed comprising components that are physically attached to a main surface of the patch antenna, the components for reactively tuning the patch antenna by tuning a first frequency inductively and a second frequency capacitively, the first frequency being lower than the second frequency, wherein the components comprise an inductive element and a capacitive element electrically connected to the patch antenna at two different points, the inductive element being electrically connected between the two points and the capacitive element being electrically connected between the two points in parallel with the inductive element; and

a shorting tab electrically connected between the ground plane and the patch antenna, wherein the shorting tab electrically connects to the patch antenna adjacent to a connection point of the feed, the shorting tab performing an impedance transformation.

2. The antenna assembly as claimed in claim 1, wherein the components comprise a series connected, parallel L-C network.

3. The antenna assembly as claimed in claim 1, wherein the components are physically located between the patch antenna and the ground plane.

4. A communications apparatus comprising:

a housing;

a printed circuit board (PCB) within the housing, the printed circuit board having a ground plane and RF circuitry disposed thereon;

a planar antenna within the housing spaced from the ground plane, the planar antenna not having any slot;

a dielectric between the PCB and the planar antenna; and

a feed coupling the planar antenna to the RF circuitry, the feed comprising components that are physically attached to a main surface of the planar antenna, the components for reactively tuning the planar antenna by tuning a first frequency inductively and a second frequency capacitively, the first frequency being lower than the second frequency, wherein the components comprise an inductive element and a capacitive element that are electrically connected to the planar antenna at two different points, the inductive element being electrically connected between the two points and the capacitive element being electrically connected between the two points in parallel with the inductive element; and

a shorting tab electrically connected between the ground plane and the planar antenna, wherein the shorting tab electrically connects to the planar antenna adjacent to a connection point of the feed, the shorting tab performing an impedance transformation.

5. The apparatus as claimed in claim 4, wherein the components are located adjacent the dielectric.

6. The apparatus as claimed in claim 4, wherein the planar antenna is a planar inverted-L antenna (PILA).

7. The apparatus as claimed in claim 4, wherein the components comprise a series connected, parallel L-C network.

8. The apparatus as claimed in claim 4, wherein the components further comprise a transmission line.

9. The apparatus as claimed in claim 4, wherein the dielectric is air.

10. The apparatus as claimed in claim 4, wherein the components are physically located between the planar antenna and the ground plane.

11. The apparatus as claimed in claim 4, wherein the components are surrounded by the dielectric.

12. An rf module comprising:

a printed circuit board (PCB) having a ground plane and RF circuitry thereon;

a planar antenna spaced from the ground plane, the planar antenna not having any slot;

a dielectric in a space between the PCB and the planar antenna; and

a feed coupling the planar antenna to the RF circuitry, the feed comprising components that are physically attached to a main surface of the planar antenna, the components for reactively tuning the planar antenna by tuning a first frequency inductively and a second frequency capacitively, the first frequency being lower than the second frequency, wherein the components comprise an inductive element and a capacitive element electrically connected to the planar antenna at two different points, the inductive element being electrically connected between the two points and the capacitive element being electrically connected between the two points in parallel with the inductive element; and

a shorting tab electrically connected between the ground plane and the planar antenna, wherein the shorting tab electrically connects to the planar antenna adjacent to a connection point of the feed, the shorting tab performing an impedance transformation.

13. The module as claimed in claim 12, wherein the components are located adjacent the dielectric.

14. The module as claimed in claim 12, wherein the components comprise a series connected, parallel L-C network.

15. The module as claimed in claim 12, wherein the dielectric is air.

16. The module as claimed in claim 12, wherein the components are physically located between the planar antenna and the ground plane.

17. The module as claimed in claim 12, wherein the components are surrounded by the dielectric.

18. A planar antenna assembly comprising:

a printed circuit board having a ground plane and RF circuitry thereon;

a planar antenna that it is spaced from the ground plane; and

a feed for coupling the planar antenna to the RF circuitry, the feed comprising components for reactively tuning the planar antenna by tuning a first frequency inductively and a second frequency capacitively, the first frequency being lower than the second frequency, the components being physically attached to a main surface of the planar antenna, wherein the components comprise an inductive element and a capacitive element electrically connected to the planar antenna at two different points, the inductive element being electrically connected between the two points and the capacitive element being electrically connected between the two points in parallel with the inductive element; and

a shorting tab electrically connected between the ground plane and the planar antenna, wherein the shorting tab electrically connects to the planar antenna adjacent to a connection point of the feed, the shorting tab performing an impedance transformation.

19. The antenna assembly as claimed in claim 18, wherein the components comprise a series connected, parallel L-C network.

20. The antenna assembly as claimed in claim 18, wherein the components are physically located between the planar antenna and the ground plane.