Electronic apparatus and method of manufacturing electronic apparatus

• US 7,844,226 B2
• Filed: 11/27/2006
• Issued: 11/30/2010
• Est. Priority Date: 03/29/2006
• Status: Expired due to Fees

• Current Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Original Assignee: Fujitsu Component Limited (Fujitsu Limited)
• Inventors: Kurashima, Shigemi, Yanagi, Masahiro, Iwata, Hideki, Arita, Takashi, Kaneko, Masahiro, Segawa, Yuriko, Yuba, Takashi
• Primary Examiner(s): Dao; Minh D
• Application Number:
  US11/604,377
• Publication Number:
  US 20070231937A1
• Time in Patent Office: 1,464 Days
• Field of Search: 455/67.11, 455/67.14, 455/456.1, 455/423, 455/115.1, 455/115.2, 455/226.1, 235/451, 235/492
• US Class Current: 455/67.11
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT

Abstract

The present invention discloses a method of manufacturing an electronic apparatus for wireless communications in that the method includes the steps of arranging an antenna apparatus adjacent to the electronic apparatus formed on a substrate and testing the electronic apparatus by conducting the wireless communications between the electronic apparatus and the antenna apparatus.

Claims

1. A method of manufacturing an electronic apparatus for wireless communication, comprising:

forming the electronic apparatus on a substrate;

forming an antenna apparatus on the same substrate on which the electronic apparatus is formed at a position adjacent to the electronic apparatus; and

testing the electronic apparatus by conducting the wireless communication between the electronic apparatus and the antenna apparatus.

2. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein the antenna apparatus is severed from the substrate after the testing of the electronic apparatus.

3. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein plural of the electronic apparatuses are formed on the substrate, wherein the plural electronic apparatuses are severed from the substrate after the testing of the electronic apparatuses.

4. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein the electronic apparatus is formed by forming a conductive pattern on the substrate.

5. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein the antenna apparatus is arranged in correspondence with the directivity of the wireless communication of the electronic apparatus.

6. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein the electronic apparatus includes an antenna part, wherein the antenna apparatus is arranged adjacent to the antenna part of the electronic apparatus.

7. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein plural of the electronic apparatuses are formed on the substrate in a proportion where a single antenna apparatus is arranged in correspondence with a predetermined number of electronic apparatuses.

8. The method of manufacturing an electronic apparatus as claimed in claim 1, wherein plural of the electronic apparatuses are formed on the substrate, wherein the electronic apparatuses are tested by conducting wireless communication with one another.

9. An electronic apparatus comprising:

an electronic device manufactured by using the method claimed in claim 1.