Light emitting diode device, method of fabrication and use thereof
First Claim
1. A light emitting diode device, for mounting on a surface, comprising a semiconductor substrate having a layer of p-type semiconductor material adjoining a layer of n-type semiconductor material and a light emitting region occupying a plane between the p- and n-type materials, a light transmissive substrate on which the semiconductor substrate is formed, the light transmissive substrate having a perimeter greater than a perimeter of the semiconductor substrate, a first terminal electrically connected to the p-type semiconductor material layer and a second terminal electrically connected to the n-type semiconductor material layer, each of said terminals comprising a contact pad which overlaps with the perimeter of the semiconductor substrate and which extends to at least the perimeter of the light transmissive substrate to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface, wherein the light emitting diode device is fabricated for mounting with the plane occupied by the light emitting region substantially perpendicular to a plane occupied by the mounting surface and wherein a primary light emission direction of the light emitting region is parallel to the plane occupied by the mounting surface.
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Accused Products
Abstract
A light emitting diode device which, in use, has its light emitting region occupying a plane substantially perpendicular to a plane occupied by the surface on which the device is mounted. The primary light emission directions of the light emitting region are parallel to the surface on which the device is mounted. The device may have both its p-type and n-type semiconductor layers passivated by a layer or layers of light transmissive materials. There is a method for fabricating and mounting such a device. A plurality of the light emitting diode devices can be used in a lighting assembly for providing a plurality of independently controllable lit regions.
30 Citations
19 Claims
- 1. A light emitting diode device, for mounting on a surface, comprising a semiconductor substrate having a layer of p-type semiconductor material adjoining a layer of n-type semiconductor material and a light emitting region occupying a plane between the p- and n-type materials, a light transmissive substrate on which the semiconductor substrate is formed, the light transmissive substrate having a perimeter greater than a perimeter of the semiconductor substrate, a first terminal electrically connected to the p-type semiconductor material layer and a second terminal electrically connected to the n-type semiconductor material layer, each of said terminals comprising a contact pad which overlaps with the perimeter of the semiconductor substrate and which extends to at least the perimeter of the light transmissive substrate to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface, wherein the light emitting diode device is fabricated for mounting with the plane occupied by the light emitting region substantially perpendicular to a plane occupied by the mounting surface and wherein a primary light emission direction of the light emitting region is parallel to the plane occupied by the mounting surface.
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3. A light emitting diode device for mounting on a surface occupying a first plane and having first and second primary light emission directions parallel to the first plane, the light emitting diode device comprising:
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a multi-layer semiconductor substrate comprising a first layer of a p-type semiconductor material, a second layer of a n-type semiconductor material located with the first layer forming a junction between the p- and n-type semiconductor materials and a light emission region occupying a second plane at the junction, a light transmissive substrate on which the multi-layer semiconductor substrate is formed, the light transmissive substrate having a perimeter greater than a perimeter of the multi-layer semiconductor substrate, a first terminal electrically connected to the p-type semiconductor material layer and a second terminal electrically connected to the n-type semiconductor material layer, each of said terminals comprising a contact pad which overlaps with the perimeter of the multi-layer semiconductor substrate and which extends to at least the perimeter of the light transmissive substrate to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface, and the light emitting diode device being fabricated for mounting on the surface with the second plane occupied by the light emission region substantially perpendicular to the first plane occupied by the surface. - View Dependent Claims (4, 5, 6, 7, 8, 9, 10)
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- 11. An edge-mount light emitting diode device, for mounting on a surface, fabricated from a semiconductor substrate such that in use a light emitting region of the device defined in the semiconductor substrate occupies a plane substantially perpendicular to a plane occupied by the mounting surface, the light emitting region of the device being totally passivated by at least one light transmissive layer having a perimeter greater than a perimeter of the semiconductor substrate such that light from said light emitting region emits into said at least one light transmissive layer in at least two opposing directions parallel to a plane occupied by said mounting surface, wherein contact pads of electrically conductive terminals connected to respective p-type and n-type layers of the semiconductor substrate which define the light emitting region extend to at least the perimeter of the at least one light transmissive layer to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface.
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14. A lighting assembly for providing a plurality of independently controllable lit regions, comprising:
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a mounting surface for mounting a plurality of light emitting diode devices, and a plurality of light emitting diode devices fabricated for mounting to the mounting surface with a plane occupied by light emitting regions of the devices substantially perpendicular to a plane occupied by the mounting surface such that light emissions of the light emitting regions are parallel to the plane occupied by the mounting surface, wherein the plurality of light emitting diode devices are arranged on the mounting surface so that each light emitting device contributes light emissions to at least two opposed lit regions and wherein each light emitting device is fabricated from a semiconductor substrate such that a light emitting region of said device defined in the semiconductor substrate is totally passivated by at least one light transmissive layer having a perimeter greater than a perimeter of the semiconductor substrate, wherein contact pads of electrically conductive terminals connected to respective p-type and n-type layers of the semiconductor substrate which define the light emitting region extend to at least the perimeter of the at least one light transmissive layer to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface. - View Dependent Claims (15, 16, 17)
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18. A light emitting diode device, for mounting on a surface, comprising a semiconductor substrate having a layer of p-type semiconductor material adjoining a layer of n-type semiconductor material and a light emitting region occupying a plane between the p- and n-type materials, wherein the light emitting diode device is fabricated for mounting with the plane occupied by the light emitting region substantially perpendicular to a plane occupied by the mounting surface and wherein the light emitting region of the device is totally passivated by at least one light transmissive layer such that light from said light emitting region emits into said at least one light transmissive layer in at least two opposing directions, wherein the at least one light transmissive layer has a perimeter greater than a perimeter of the semiconductor substrate and contact pads of electrically conductive terminals connected respectively to the p-type and n-type layers of the semiconductor substrate extend to at least the perimeter of the at least one light transmissive layer to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface.
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19. An edge-mount light emitting diode device, for mounting on a surface, fabricated such that in use a light emitting region of the device occupies a plane substantially perpendicular to a plane occupied by the mounting surface, wherein the semiconductor substrate has first and second terminals for powering said light emitting region, each of said terminals comprising a contact pad which overlaps with a perimeter of the semiconductor substrate, the edge-mount light emitting diode device including a light transmissive substrate on which the semiconductor substrate is formed, the light transmissive substrate having a perimeter greater than a perimeter of the semiconductor substrate, wherein contact pads of each of said terminals extend to at least the perimeter of the light transmissive substrate to thereby be exposed to enable the diode device to be electrically bonded to an electrical circuit on the mounting surface.
Specification