Multilayer film with stack of nanometer-scale thicknesses

• US 7,847,368 B2
• Filed: 04/16/2008
• Issued: 12/07/2010
• Est. Priority Date: 02/28/2005
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Kornilovich, Paval, Mardilovich, Peter, Ramamoorthi, Sriram
• Primary Examiner(s): Pham; Thanh V
• Application Number:
  US12/104,252
• Publication Number:
  US 20090126977A1
• Time in Patent Office: 965 Days
• Field of Search: 257/211, 257/508, 438/128, 438/598, 438/623, 977/932
• US Class Current: 257/508
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/081 of aluminium, magnesium or beryllium
• CPC Class Codes: C23C 14/165 by cathodic sputtering
• CPC Class Codes: H01L 21/768 Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
• CPC Class Codes: H01L 21/76802 by forming openings in dielectrics
• CPC Class Codes: H01L 23/5283 Cross-sectional geometry
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 3/048 using a lift-off resist pattern or a release layer pattern
• CPC Class Codes: Y10S 148/026 Deposition thru hole in mask
• CPC Class Codes: Y10S 977/932 for electronic or optoelectronic application

Abstract

This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film.

Claims

1. A multilayer film having multiple nanometer-scale-thickness conductive layers and multiple micrometer-or-larger-scale contact regions, each of the multiple micrometer-or-larger-scale contact regions enabling individual electrical communication with one of the multiple nanometer-scale-thickness conductive layers, wherein the multiple nanometer-scale-thickness conductive layers comprise a stack of at least about one hundred individual nanometer-scale-thickness conductive layers each individually having one of the multiple micrometer-or-larger-scale contact regions.

2. The multilayer film of claim 1, wherein the multiple micrometer-or-larger-scale contact regions are separated one from the other by at least about one micron.

3. The multilayer film of claim 1, further comprising multiple nanometer-scale-thickness insulative layers residing between the multiple nanometer-scale-thickness conductive layers.

4. The multilayer film of claim 1, wherein the multiple micrometer-or-larger-scale contact regions are oriented in multiple rows.

5. The multilayer film of claim 1, wherein the multilayer film resides over a support structure enabling exposure of edges of the multiple nanometer-scale-thickness conductive layers in a plane about parallel to a plane in which the multiple micrometer-or-larger-scale contact regions reside.

6. The multilayer film of claim 1, wherein each of the contact regions is exposed to provide the individual electrical communication with an external electrical conductor.

7. A multilayer film comprising:

a plurality of conductive layers, each conductive layer having an exposed edge having a thickness between about one and about 100 nanometers;

a plurality of insulative layers, each insulative layer having an exposed edge having a thickness between about one and about 500 nanometers; and

a plurality of contact regions, each contact region enabling individual electrical communication with one of the conductive layers and having an exposed area, each dimension of the exposed area being at least about an order of magnitude larger than the thickness of the exposed edge of the conductive layer with which the contact region enables electrical communication;

wherein the plurality of conductive layers have multiple nanometer-scale-thicknesses and form a stack of at least about one hundred individual nanometer-scale-thickness conductive layers each individually having one of the multiple micrometer-or-larger-scale contact regions.

8. The multilayer film of claim 7, wherein the exposed areas of the plurality of contact regions are separated one from the other by at least about one micron.

9. The multilayer film of claim 7, wherein the plurality of contact regions are oriented in a plurality of rows.

10. The multilayer film of claim 7, wherein the multiple micrometer-or-larger-scale contact regions are oriented in multiple rows.

11. The multilayer film of claim 7, wherein the multilayer film resides over a support structure enabling exposure of edges of the multiple nanometer-scale-thickness conductive layers in a plane about parallel to a plane in which the multiple micrometer-or-larger-scale contact regions reside.

12. The multilayer film of claim 7 wherein the exposed area of each contact region is configured to provide electrical communication with an external electrical conductor.

13. A multilayer film comprising:

a stack of at least tens of alternating electrically conductive layers and electrically insulative layers, wherein each electrically conductive layer has a contact region and a passage extending from the contact region through all the layers of the stack above the contact region;

wherein the stack having nanometer-scale-thickness conductive layers comprise at least a stack of tens of individual nanometer-scale-thickness conductive layers each individually having one of the micrometer-or-larger-scale contact regions.

14. The multilayer film of claim 13, wherein the electrically insulative layers line the passage to separate the electrically conductive layers above the contact region from the passage.

15. The multilayer film of claim 13, wherein the contact regions are micrometer or larger scale contact regions and wherein each of the electrically conductive layers has a nanometer-scale thickness.

16. The multilayer film of claim 15, wherein the micrometer-or-larger-scale contact regions are separated one from the other by at least about one micron.

17. The multilayer film of claim 15, wherein the multilayer film resides over a support structure enabling exposure of edges of the nanometer-scale-thickness conductive layers in a plane about parallel to a plane in which the micrometer-or-larger-scale contact regions reside.

18. The multilayer film of claim 13, wherein the contact region is exposed through the passage to allow individual electrical communication with external electrical conductors.

19. The multilayer film of claim 13, wherein the passage extends opposite to and across edges of a plurality of the electrically conductive layers and wherein the passage extends opposite to and across edges of a plurality of the insulative layers to allow electrical communication with the contact region through the passage.