B-stageable die attach adhesives
First Claim
Patent Images
1. A method for adhesively attaching a first substrate to a second substrate, said method comprising:
- a. applying a composition to one or both of said first substrate or said second substrate, wherein the composition is a b-stage curable composition comprising;
a. a solid component heat curable at a first temperature;
b. a liquid component, which is either heat curable at a second temperature or curable upon exposure to radiation in the electromagnetic spectrum; and
c. a heat cure catalyst for the solid curable component;
b. exposing the composition-applied substrate to conditions favorable to effect cure of the liquid curable component thereof, thereby forming a b-staged curable film;
c. exposing the b-staged curable film of b. to a temperature in the range of 90°
C. and 160°
C. sufficient to melt the solid curable component thereof;
d. adjoining said first substrate with said second substrate to form an assembly wherein said first substrate and said second substrate are separated by the composition applied in a.; and
e. exposing the curable film of c. to a temperature condition in the range of 150°
C. and 200°
C. to cure the melted, solid curable component.
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Accused Products
Abstract
The present invention relates to b-stageable die attach adhesives, methods of preparing such adhesives, methods of applying such adhesives to the die and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.
53 Citations
7 Claims
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1. A method for adhesively attaching a first substrate to a second substrate, said method comprising:
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a. applying a composition to one or both of said first substrate or said second substrate, wherein the composition is a b-stage curable composition comprising; a. a solid component heat curable at a first temperature; b. a liquid component, which is either heat curable at a second temperature or curable upon exposure to radiation in the electromagnetic spectrum; and c. a heat cure catalyst for the solid curable component; b. exposing the composition-applied substrate to conditions favorable to effect cure of the liquid curable component thereof, thereby forming a b-staged curable film; c. exposing the b-staged curable film of b. to a temperature in the range of 90°
C. and 160°
C. sufficient to melt the solid curable component thereof;d. adjoining said first substrate with said second substrate to form an assembly wherein said first substrate and said second substrate are separated by the composition applied in a.; and e. exposing the curable film of c. to a temperature condition in the range of 150°
C. and 200°
C. to cure the melted, solid curable component. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An article of manufacture comprising a semiconductor chip which is provided for attachment to and electrical interconnection with another semiconductor chip or a carrier substrate, the semiconductor chip having a first surface and a second surface, with the first surface having electrical contacts arranged in a predetermined pattern thereon for providing electrical engagement with the another semiconductor chip or the carrier substrate, respectively, and with the second surface having a b stage heat curable composition disposed on a layer or a portion thereof, wherein the composition is a b-stage curable composition comprising:
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a. a solid component heat curable at a first temperature; b. a liquid component, which is either heat curable at a second temperature or curable upon exposure to radiation in the electromagnetic spectrum; and c. a heat cure catalyst for the solid curable component.
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Specification