Coil module apparatus

• US 7,852,184 B2
• Filed: 05/28/2008
• Issued: 12/14/2010
• Est. Priority Date: 05/29/2007
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group), Sony Ericsson Mobile Communications Japan Incorporated (Sony Group Corp.)
• Original Assignee: Seiko Epson Corporation (Seiko Group), Sony Ericsson Mobile Communications Japan Incorporated (Sony Group Corp.)
• Inventors: Suzuki, Katsuya, Yamazaki, Manabu, Onishi, Kota, Jin, Mikimoto, Kato, Hiroshi, Kondo, Yoichiro, Suzuki, Kuniharu, Yoda, Kentaro
• Primary Examiner(s): NGUYEN, TUYEN T
• Application Number:
  US12/153,935
• Publication Number:
  US 20080297295A1
• Time in Patent Office: 930 Days
• Field of Search: 336/65, 336/83, 336/84.R, 336/84.M, 336/84.C, 336/200, 336/232, 320/108
• US Class Current: 336/84.00M
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01F 27/04 Leading of conductors or axles through casings, e.g. for tap-changing arrangements
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/361 made of combinations of electrically conductive material and ferromagnetic material
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/003 Printed circuit coils

Abstract

A coil module apparatus is provided. The coil module apparatus includes a flat coil, a circuit board, a magnetic sheet, connection terminals, and a case. The flat coil has a flat shape. The circuit board is used for the flat coil. The magnetic sheet is provided so as to cover one surface portion of the flat coil. The connection terminals are provided for connecting the flat coil and the circuit board. The case encloses the flat coil, the circuit board, and the magnetic sheet and encloses the connection terminals so that the connection terminals are partly exposed.

Claims

1. A coil module apparatus comprising:

a flat coil having a flat shape and defining a first plane;

a circuit board in electrical communication with the flat coil, the circuit board having a flat shape and defining a second plane;

a flat magnetic sheet provided so as to entirely cover one surface portion of the flat coil, the flat magnetic sheet defining a third plane;

connection terminals for electrically connecting the flat coil and the circuit board; and

a case that encases the flat coil, the circuit board, and the magnetic sheet and partially encloses the connection terminals so that the connection terminals are partly exposed,

wherein the first and second planes extend parallel to one another and are at least in facial contact with one another and the first and third planes extend parallel to one another in an adjacent yet spaced-apart manner.

2. A coil module apparatus according to claim 1, wherein

the flat coil is one of:

a flat coil formed by winding a wire composed of one of a conductive single wire and a conductive twisted wire into a spiral on a substantially flat plane, and

a flat coil formed by stacking a plurality of conductive pattern circuit boards, on which conductive patterns that each form part of the flat coil are formed, so that a spiral flat coil pattern is formed of the conductive patterns and electrically connecting the conductive patterns.

3. A coil module apparatus according to claim 1, wherein

the flat coil enclosed in the case is a flat coil formed by winding a wire composed of one of a conductive single wire and a conductive twisted wire into a spiral on a substantially flat plane, and the case includes a flat coil insertion portion in the form of a groove with a shape that matches the flat coil and is provided in a surface portion contacted by the flat coil.

4. A coil module apparatus according to claim 1, wherein

the flat coil, which is formed by winding a wire composed of one of a conductive single wire and a conductive twisted wire into a spiral on a substantially flat plane, is insert molded inside one surface portion of the case.

5. A coil module apparatus according to claim 1, wherein

the magnetic sheet is insert molded inside the case.

6. A coil module apparatus according to claim 1, wherein

the magnetic sheet is integrally formed with one surface portion of the case by mixing a magnetic material into a predetermined resin that forms the one surface portion of the case.

7. A coil module apparatus according to claim 1, wherein

the magnetic sheet is formed by mixing a magnetic material into a predetermined resin, and one surface portion of the case is dual molded of a resin that forms the one surface of the case and the magnetic sheet that is formed by mixing the magnetic material into the predetermined resin.

8. A coil module apparatus according to claim 7, wherein

the flat coil is insert molded between the resin that forms the one surface portion of the case and the magnetic sheet that is formed by mixing the magnetic material into the predetermined resin.

9. A coil module apparatus according to claim 1, further comprising

a metal sheet that is enclosed inside the case and is provided so as to cover the flat coil from above the magnetic sheet.

10. A coil module apparatus according to claim 9, wherein

the metal sheet is insert molded inside the case.

11. A coil module apparatus according to claim 10, wherein

the metal sheet is insert molded between resin that forms one surface portion of the case and the magnetic sheet which is formed by mixing a magnetic material into a predetermined resin.

12. A coil module apparatus according to claim 1, further comprising

a temperature detecting unit that is enclosed inside the case and detects a temperature of the flat coil.

13. A coil module apparatus according to claim 12, wherein

the temperature detecting unit is insert molded inside one surface portion of the case.

14. A coil module apparatus according to claim 1, wherein

the circuit board is insert molded inside one surface portion of the case.

15. A coil module apparatus according to claim 14, wherein

the circuit board insert molded in the case is composed of a multilayer circuit board and the temperature detecting unit is provided between any two layers of the multilayer circuit board.

16. A coil module apparatus according to claim 1, wherein

a surface portion of the case that contacts a battery pack, which is provided in an appliance to which the coil module apparatus is attached, is formed of elastic resin.

17. A coil module apparatus according to claim 1, wherein

a surface portion of the case that faces an opposite surface portion of the flat coil to the surface portion covered by the magnetic sheet is processed so as to be shaped as a rear cover of a charged appliance to which the coil module apparatus is attached.