Coil transducer with reduced arcing and improved high voltage breakdown performance characteristics
First Claim
1. A coil transducer, comprising:
- a generally planar electrically insulating substrate comprising opposing first upper and first lower surfaces, the substrate forming a dielectric barrier and comprising an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material, the substrate having no ferrite, magnetic, ferromagnetic, or electroconductive core, or core material, disposed therewithin or thereon;
a first electrically conductive coil comprising at least a first metalized layer located above the first upper surface of the substrate;
a second electrically conductive coil comprising at least a third metalized layer located beneath the first lower surface of the substrate;
at least a first metalized via electrically connected to the first coil and extending to or near a second upper surface of the coil transducer for electrical connection to a first contact disposed thereon or therein, andat least a second metalized via electrically connected to the second coil and extending to or near a second lower surface of the coil transducer for electrical connection to a second contact disposed thereon or therein;
wherein the first and second coils are not connected electrically to one another and are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil vertically across the substrate, the first coil is separated from the second coil by a vertical distance exceeding about 1/1,000th of an inch (1 mil), and a breakdown voltage between the first coil and the second coil exceeds about 1,000 volts RMS.
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Accused Products
Abstract
Disclosed herein are various embodiments of coil transducers and galvanic isolators configured to provide high voltage isolation and high voltage breakdown performance characteristics in small packages. A coil transducer is provided across which data or power signals may be transmitted and received by primary and secondary coils disposed on opposing sides thereof without high voltage breakdowns occurring therebetween. At least portions of the coil transducer are formed of an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material. The coil transducer may be formed in a small package using, by way of example, printed circuit board, CMOS-compatible and other fabrication and packaging processes.
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Citations
31 Claims
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1. A coil transducer, comprising:
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a generally planar electrically insulating substrate comprising opposing first upper and first lower surfaces, the substrate forming a dielectric barrier and comprising an electrically insulating, non-metallic, non-semiconductor, low dielectric loss material, the substrate having no ferrite, magnetic, ferromagnetic, or electroconductive core, or core material, disposed therewithin or thereon; a first electrically conductive coil comprising at least a first metalized layer located above the first upper surface of the substrate; a second electrically conductive coil comprising at least a third metalized layer located beneath the first lower surface of the substrate; at least a first metalized via electrically connected to the first coil and extending to or near a second upper surface of the coil transducer for electrical connection to a first contact disposed thereon or therein, and at least a second metalized via electrically connected to the second coil and extending to or near a second lower surface of the coil transducer for electrical connection to a second contact disposed thereon or therein; wherein the first and second coils are not connected electrically to one another and are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil vertically across the substrate, the first coil is separated from the second coil by a vertical distance exceeding about 1/1,000th of an inch (1 mil), and a breakdown voltage between the first coil and the second coil exceeds about 1,000 volts RMS. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A coil transducer, comprising:
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a generally planar electrically insulating substrate comprising opposing first upper and first lower surfaces, the substrate forming a dielectric barrier and comprising an electrically insulating, non-metallic, non-semiconductor low-dielectric-loss material having a dielectric loss tangent at room temperature that is less than or equal to 0.05, the substrate having no ferrite, magnetic, ferromagnetic, or electroconductive core, or core material, disposed therewithin or thereon; a first electrically conductive coil comprising at least a first metalized layer located above the first upper surface of the substrate; a second electrically conductive coil comprising at least a third metalized layer located beneath the first lower surface of the substrate; at least a first metalized via electrically connected to the first coil and extending to or near a second upper surface of the coil transducer for electrical connection to a first contact disposed thereon or therein, and at least a second metalized via electrically connected to the second coil and extending to or near a second lower surface of the coil transducer for electrical connection to a second contact disposed thereon or therein; wherein the first and second coils are not connected electrically to one another and are spatially arranged and configured respecting one another such that at least one of power and data signals may be transmitted by the first coil to the second coil vertically across the substrate, the first metalized layer is separated from the third metalized layer by a vertical distance exceeding about 1/1,000th of an inch (1 mil), and a breakdown voltage between the first coil and the second coil exceeds about 1,000 volts RMS. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification