Chip level biostable interconnect for implantable medical devices

• US 7,853,328 B2
• Filed: 04/16/2007
• Issued: 12/14/2010
• Est. Priority Date: 04/26/2005
• Status: Expired due to Fees

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Receveur, Rogier
• Primary Examiner(s): Layno; Carl H
• Assistant Examiner(s): Gedeon; Brian T
• Application Number:
  US11/735,832
• Publication Number:
  US 20070260287A1
• Time in Patent Office: 1,338 Days
• Field of Search: 607/37, 607/36, 607/38
• US Class Current: 607/37
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13599 Material
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29599 Material
• CPC Class Codes: H01L 2924/00013 Fully indexed content
• CPC Class Codes: Y10S 439/909 Medical use or attached to human body

Abstract

A lead is connected to an integrated circuit in an implantable medical device in a lead bonding area that includes a lead-receiving recessed region. At least a portion of a lead conductor is bonded in the lead-receiving recessed region, making an electrical and mechanical connection to the integrated circuit that is strong and potentially biostable. In some embodiments, a filler material is provided around the recessed portion of the integrated circuit that receives the lead conductor, and a metal coating is provided around an outer surface of the filler material for additional mechanical stability.

Claims

1. A lead chip level biostable interconnect structure for an implantable medical device, comprising:

an integrated circuit having a lead bonding area that includes a lead-receiving recessed region selected from a shape of a semicircle, a triangle, a square, and a rectangle, wherein the integrated circuit carries electronics, wherein the lead-receiving recessed region comprises a region formed in a surface of the integrated circuit, wherein at least a portion of the lead-receiving recessed region is defined by one or more conductive walls; and

a lead conductor having at least a portion thereof bonded in the lead-receiving recessed region and in contact with at least the one or more conductive walls, wherein the lead conductor is conductively connected to the electronics carried by the integrated circuit.

2. The structure of claim 1, further comprising a non-conductive filler material around the lead-receiving recessed region.

3. The structure of claim 2, wherein the integrated circuit carries a pressure sensor that is not covered by the non-conductive filler material.

4. The structure of claim 2, further comprising a metal coating over an outer surface of the filler material.

5. The structure of claim 1, wherein conductive connection between the lead conductor and the electronics carried by the integrated circuit is achieved by a conductive lining of the lead-receiving recessed region and a conductive via extending through the integrated circuit to the electronics.

6. The structure of claim 1, wherein the conductive connection between the lead conductor and the electronics carried by the integrated circuit is achieved by a conductive lining of the lead-receiving recessed region and a conductive trace on a surface of the integrated circuit extending from the lead-receiving recessed region to the electronics.

7. The structure of claim 1, wherein a capacitor is mounted to a portion of the integrated circuit that carries the electronics.

8. The structure of claim 7, further comprising a non-conductive filler material around the lead-receiving recessed region, configured so that the electronics, the capacitor and the pressure sensor carried by the integrated circuit are not covered by the non-conductive filler material.

9. The structure of claim 1, wherein the recessed region is semicircular in shape.

10. The structure of claim 1, wherein the recessed region is triangular in shape.

11. The structure of claim 1, wherein the recessed region is rectangular in shape.

12. The structure of claim 1, wherein the recessed region is square in shape.

13. The structure of claim 1, wherein all of the cross-section of at least a portion of the lead conductor orthogonal to a length of the lead conductor is received in the lead-receiving recessed region.

14. The structure of claim 1, wherein an electronic component is mounted to a portion of the integrated circuit that carries the electronics, and wherein the electronic component is covered by the non-conductive filler material.

15. The structure of claim 1, wherein the structure is locatable at a distal part of a lead body.

16. A chip level biostable interconnect for interconnecting a lead to an integrated circuit in an implantable medical device, comprising:

a lead conductor bonded to the integrated circuit in a lead bonding area;

a non-conductive filler material around the lead conductor in at least the lead bonding area; and

a metal coating around an outer surface of the non-conductive filler material.

17. The interconnect of claim 16, wherein the integrated circuit carries a pressure sensor, and wherein the non-conductive filler material does not cover the pressure sensor.

18. The interconnect of claim 16, wherein the integrated circuit carries electronics conductively connected to the lead conductor by a conductive via extending through the integrated circuit in a region that is covered by the non-conductive filler material.

19. The interconnect of claim 16, wherein the integrated circuit carries electronics conductively connected to the lead conductor by a conductive trace on a surface of the integrated circuit, the electronics being located in a region that is not covered by the non-conductive filler material.

20. The interconnect of claim 16, wherein the metal coating is composed of titanium.

21. A lead chip level biostable interconnect structure for an implantable medical device, comprising:

an integrated circuit having a lead bonding area that includes a lead-receiving recessed region selected from a shape of a semicircle, a triangle, a square, and a rectangle;

a lead conductor having at least a portion thereof bonded in the lead-receiving recessed region; and

a non-conductive filler material around the lead-receiving recessed region.