Method of fabricating an ultra-small condenser microphone
First Claim
1. A method of fabricating an ultra-small condenser microphone, comprising the steps of:
- (a) forming a plurality of ultra-small condenser microphones, each of the ultra-small condenser microphones including a semiconductor substrate, and a fixed electrode arranged opposite a vibration electrode via a space and a dielectric film arranged between the fixed and vibration electrodes, the fixed electrode and the vibration electrode being disposed on the semiconductor substrate;
(b) after the step (a), sticking a sheet on a first surface of the semiconductor substrate, the first surface being opposite to a second surface on which the vibration electrode is formed;
(c) after the step (b), disposing the ultra-small condenser microphone facing a tip of a needle discharge electrode;
(d) after the step (c), performing electretization for fixing charges in the dielectric film by irradiating each dielectric film arranged between each fixed electrode and each vibration electrode provided in the plurality of the ultra-small condenser microphones with ions generated from the discharge electrode in a state that a predetermined potential difference is given between the fixed electrode and the vibration electrode in each ultra-small condenser microphones; and
(e) after the step (d), separating the semiconductor substrate stuck on the sheet into individual ultra-small condenser microphone pieces.
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Accused Products
Abstract
In the present invention, a semiconductor substrate wherein a plurality of MEMS microphones is formed is disposed opposed to a discharge electrode in a state of being stuck on a sheet. Electretization of a dielectric film provided in the MEMS microphone is performed by irradiating the dielectric film between a fixed electrode and a vibration film provided in the MEMS microphone with ions resulting from a corona discharge of the discharge electrode in a state that a predetermined potential difference is applied to the fixed electrode and the vibration film and fixing charges based on the ions to the dielectric film. The electretization is successively performed to each MEMS microphone on the semiconductor substrate by relatively moving the semiconductor substrate and the discharge electrode. Therefore, electretization of the dielectric film in the MEMS microphone chip is realized using a low-cost and simple fabricating equipment and productivity can be enhanced.
64 Citations
17 Claims
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1. A method of fabricating an ultra-small condenser microphone, comprising the steps of:
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(a) forming a plurality of ultra-small condenser microphones, each of the ultra-small condenser microphones including a semiconductor substrate, and a fixed electrode arranged opposite a vibration electrode via a space and a dielectric film arranged between the fixed and vibration electrodes, the fixed electrode and the vibration electrode being disposed on the semiconductor substrate; (b) after the step (a), sticking a sheet on a first surface of the semiconductor substrate, the first surface being opposite to a second surface on which the vibration electrode is formed; (c) after the step (b), disposing the ultra-small condenser microphone facing a tip of a needle discharge electrode; (d) after the step (c), performing electretization for fixing charges in the dielectric film by irradiating each dielectric film arranged between each fixed electrode and each vibration electrode provided in the plurality of the ultra-small condenser microphones with ions generated from the discharge electrode in a state that a predetermined potential difference is given between the fixed electrode and the vibration electrode in each ultra-small condenser microphones; and (e) after the step (d), separating the semiconductor substrate stuck on the sheet into individual ultra-small condenser microphone pieces. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of fabricating an ultra-small condenser microphone, comprising the steps of:
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(a) forming a plurality of ultra-small condenser microphones, each of the ultra-small condenser microphones including a semiconductor substrate, and a fixed electrode arranged opposite a vibration electrode via a space and a dielectric film arranged between the fixed and vibration electrodes, the fixed electrode and the vibration electrode being disposed on the semiconductor substrate; (b) after the step (a), sticking a sheet on a first surface of the semiconductor substrate, the first surface being opposite to a second surface on which the vibration electrode is formed; (c) after the step (b), disposing the ultra-small condenser microphone facing a linear discharge electrode; (d) after the step (c), performing electretization for fixing charges in the dielectric film by irradiating each dielectric film arranged between each fixed electrode and each vibration electrode provided in the plurality of the ultra-small condenser microphones with ions generated from the discharge electrode in a state that a predetermined potential difference is given between the fixed electrode and the vibration electrode in each ultra-small condenser microphone; and (e) after the step (d), separating the semiconductor substrate stuck on the sheet into individual ultra-small condenser microphone pieces. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification