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Integrated circuit package system with an encapsulant cavity and method of fabrication thereof

  • US 7,855,100 B2
  • Filed: 03/27/2008
  • Issued: 12/21/2010
  • Est. Priority Date: 03/31/2005
  • Status: Active Grant
First Claim
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:

  • forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof;

    attaching a component on the interposer in the encapsulant cavity wherein forming the first integrated circuit package comprises;

    mounting a second integrated circuit package on the interposer in the encapsulant cavity;

    mounting a third integrated circuit package on a substrate;

    attaching a spacer on the third integrated circuit package; and

    mounting the first integrated circuit package on the spacer.

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