Integrated circuit package system with an encapsulant cavity and method of fabrication thereof
First Claim
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
- forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof;
attaching a component on the interposer in the encapsulant cavity wherein forming the first integrated circuit package comprises;
mounting a second integrated circuit package on the interposer in the encapsulant cavity;
mounting a third integrated circuit package on a substrate;
attaching a spacer on the third integrated circuit package; and
mounting the first integrated circuit package on the spacer.
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Abstract
An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.
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Citations
16 Claims
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1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
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forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; attaching a component on the interposer in the encapsulant cavity wherein forming the first integrated circuit package comprises; mounting a second integrated circuit package on the interposer in the encapsulant cavity; mounting a third integrated circuit package on a substrate; attaching a spacer on the third integrated circuit package; and mounting the first integrated circuit package on the spacer. - View Dependent Claims (2, 3)
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4. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
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mounting a first integrated circuit on a first surface of an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; molding a first encapsulant over the first integrated circuit forming a first integrated circuit package; mounting the first integrated circuit package with an inverted bottom terminal over a substrate; molding a second encapsulant over the first integrated circuit package with the inverted bottom terminal and the substrate forming an encapsulant cavity having a second surface of the interposer substantially exposed; and mounting a component on the second surface of the interposer in the encapsulant cavity. - View Dependent Claims (5, 6, 7, 8)
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9. An encapsulant cavity integrated circuit package system comprising:
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a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, the interposer having an integrated circuit electrically connected to and on a top thereof; a component on the interposer in the encapsulant cavity wherein the first integrated circuit package comprises;
a second integrated circuit package on the interposer in the encapsulant cavity;
a third integrated circuit package on a substrate;
a spacer on the third integrated circuit package; and
the first integrated circuit package on the spacer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification