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Method for packaging semiconductor device and package structure thereof

  • US 7,855,424 B2
  • Filed: 11/30/2006
  • Issued: 12/21/2010
  • Est. Priority Date: 12/02/2005
  • Status: Active Grant
First Claim
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1. A method for packaging an semiconductor device, the method comprising:

  • providing a first substrate, at least one semiconductor device disposed on a surface of the first substrate, the first substrate comprising at least one first pattern;

    providing a spacer with at least one aperture and at least one through hole, wherein the through hole is smaller than the aperture;

    connecting the first substrate and the spacer by aiming the first pattern at the through hole, so that the semiconductor device is positioned correspondingly to the aperture;

    providing a second substrate comprising at least one second pattern; and

    connecting the spacer and the second substrate by aiming the second pattern at the through hole.

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